SLLSF32C November   2018  – March 2019 THVD1419 , THVD1429

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      THVD1419 and THVD1429 Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings [IEC]
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Dissipation
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Electrostatic Discharge (ESD) Protection
      2. 9.3.2 Electrical Fast Transient (EFT) Protection
      3. 9.3.3 Surge Protection
      4. 9.3.4 Failsafe Receiver
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Data Rate and Bus Length
        2. 10.2.1.2 Stub Length
        3. 10.2.1.3 Bus Loading
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Third-Party Products Disclaimer
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
|VOD| Driver differential output voltage magnitude
RL = 60 Ω, -12 V ≤ Vtest ≤ 12 V, see Figure 10 		1.5 3.5 V
|VOD| Driver differential output voltage magnitude RL = 60 Ω, -12 V ≤ Vtest ≤ 12 V, 4.5 V ≤ VCC ≤ 5.5 V, see Figure 10 2.1 V
|VOD| Driver differential output voltage magnitude RL = 100 Ω, see Figure 11 2 4 V
|VOD| Driver differential output voltage magnitude RL = 54 Ω, see Figure 11 1.5 3.5 V
Δ|VOD| Change in differential output voltage RL = 54 Ω, see Figure 11 -200 200 mV
VOC Common-mode output voltage 1 VCC / 2 3 V
ΔVOC(SS) Change in steady-state common-mode output voltage -200 200 mV
IOS Short-circuit output current DE = VCC, -7 V ≤ VO ≤ 12 V -250 250 mA
Receiver
II Bus input current DE = 0 V, VCC = 0 V or 5.5 V VI = 12 V 50 125 µA
VI = -7 V -100 -65 µA
VI = -12 V -150 -100 µA
VTH+ Positive-going input threshold voltage Over common-mode range of ±12 V See(1) -100 -20 mV
VTH- Negative-going input threshold voltage -200 -130 See(1) mV
VHYS Input hysteresis 30 mV
CA,B Input differential capacitance Measured between A and B, f = 1 MHz 220 pF
VOH Output high voltage IOH = -8 mA VCC – 0.4 VCC – 0.3 V
VOL Output low voltage IOL = 8 mA 0.2 0.4 V
IOZR Output high-impedance current VO = 0 V or VCC, RE = VCC -1 1 µA
Logic
IIN Input current (D, DE, RE) 4.5 V ≤ VCC ≤ 5.5 V -6.2 6.2 µA
Device
ICC Supply current (quiescent) Driver and receiver enabled RE = 0 V, DE = VCC, No load 2.4 3 mA
Driver enabled, receiver disabled RE = VCC, DE = VCC, No load 2 2.6 mA
Driver disabled, receiver enabled RE = 0 V, DE = 0V, No load 700 960 µA
Driver and receiver disabled RE = VCC, DE = 0 V, D = open, No load 0.1 2 µA
TSD Thermal shutdown temperature 170 ℃
(1) Under any specific conditions, VTH+ is assured to be at least VHYS higher than VTH–.