SLASEJ5B October   2017  – January 2020 TLC6C5816-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Typical Application Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable (EN)
      2. 7.3.2 Gated Output (Gx)
      3. 7.3.3 Register Clear (CLR)
      4. 7.3.4 Open-Drain Outputs and Flexible Diagnostics Channel
        1. 7.3.4.1 Configurable Outputs
        2. 7.3.4.2 LED-Open Diagnostics
        3. 7.3.4.3 LED-Short Diagnostics
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Command Error
      7. 7.3.7 Serial Communication Error
      8. 7.3.8 Error Feedback
      9. 7.3.9 Interface
        1. 7.3.9.1 Register Write
        2. 7.3.9.2 Register Read
        3. 7.3.9.3 Shift-Register Communication-Fault Detection
        4. 7.3.9.4 Clear Register
        5. 7.3.9.5 Register Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 POR Reset
      3. 7.4.3 Standby Mode
    5. 7.5 Register Maps
    6. 7.6 Interface Registers
      1. 7.6.1 Configuration Register (Offset = 0h) [reset = 0h]
        1. Table 5. Configuration Register Field Descriptions
      2. 7.6.2 Fault Readback Register (Offset = 1h) [reset = 0h]
        1. Table 6. Fault Readback Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Register Maps

Table 2. Register Map

CONFIGURATION REGISTER
Bit 23 22 21 20 19 18 17 16
Field name DIAG14 DIAG12 DIAG10 DIAG8 DIAG6 DIAG4 DIAG2 DIAG0
Default value 0h 0h 0h 0h 0h 0h 0h 0h
Bit 15 14 13 12 11 10 9 8
Field name DRAIN15 DRAIN14 DRAIN13 DRAIN12 DRAIN11 DRAIN10 DRAIN9 DRAIN8
Default value 0h 0h 0h 0h 0h 0h 0h 0h
Bit 7 6 5 4 3 2 1 0
Field name DRAIN7 DRAIN6 DRAIN5 DRAIN4 DRAIN3 DRAIN2 DRAIN1 DRAIN0
Default value 0h 0h 0h 0h 0h 0h 0h 0h
FAULT_READBACK REGISTER
Bit 23 22 21 20 19 18 17 16
Field name DIAG14_ OPEN DIAG14_ SHORT DIAG12_ OPEN DIAG12_ SHORT DIAG10_ OPEN DIAG10_ SHORT DIAG8_OPEN DIAG8_ SHORT
Default value 0h 0h 0h 0h 0h 0h 0h 0h
Bit 15 14 13 12 11 10 9 8
Field name DIAG6_OPEN DIAG6_ SHORT DIAG4_OPEN DIAG4_ SHORT DIAG2_OPEN DIAG2_ SHORT DIAG0_OPEN DIAG0_ SHORT
Default value 0h 0h 0h 0h 0h 0h 0h 0h
Bit 7 6 5 4 3 2 1 0
Field name TSD CMD_ERR CRC
Default value 0h 0h 0h