SLLSEB8C August   2012  – April  2016 TLK105 , TLK106

PRODUCTION DATA.  

  1. 1  Introduction
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Device Overview
      1. 1.3.1 Electrostatic Discharge Caution
  2. 2 Pin Descriptions
    1. 2.1 Pin Layout
    2. 2.2 Serial Management Interface (SMI)
    3. 2.3 MAC Data Interface
    4. 2.4 10Mbs and 100Mbs PMD Interface
    5. 2.5 Clock Interface
    6. 2.6 LED Interface
    7. 2.7 Reset and Power Down
    8. 2.8 Power and Bias Connections
  3. 3 Hardware Configuration
    1. 3.1  Bootstrap Configuration
    2. 3.2  Power Supply Configuration
      1. 3.2.1 Single Supply Operation
      2. 3.2.2 Dual Supply Operation
      3. 3.2.3 Variable IO Voltage
    3. 3.3  IO Pins Hi-Z State During Reset
    4. 3.4  Auto-Negotiation
    5. 3.5  Auto-MDIX
    6. 3.6  MII Isolate Mode
    7. 3.7  PHY Address
    8. 3.8  LED Interface
    9. 3.9  Loopback Functionality
      1. 3.9.1 Near-End Loopback
      2. 3.9.2 Far-End Loopback
    10. 3.10 BIST
    11. 3.11 Cable Diagnostics
      1. 3.11.1 TDR
      2. 3.11.2 ALCD
  4. 4 Interfaces
    1. 4.1 Media Independent Interface (MII)
    2. 4.2 Reduced Media Independent Interface (RMII)
    3. 4.3 Serial Management Interface
      1. 4.3.1 Extended Address Space Access
        1. 4.3.1.1 Write Address Operation
        2. 4.3.1.2 Read Address Operation
        3. 4.3.1.3 Write (no post increment) Operation
        4. 4.3.1.4 Read (no post increment) Operation
        5. 4.3.1.5 Write (post increment) Operation
        6. 4.3.1.6 Read (post increment) Operation
  5. 5 Architecture
    1. 5.1 100Base-TX Transmit Path
      1. 5.1.1 MII Transmit Error Code Forwarding
      2. 5.1.2 4-Bit to 5-Bit Encoding
      3. 5.1.3 Scrambler
      4. 5.1.4 NRZI and MLT-3 Encoding
      5. 5.1.5 Digital to Analog Converter
    2. 5.2 100Base-TX Receive Path
      1. 5.2.1  Analog Front End
      2. 5.2.2  Adaptive Equalizer
      3. 5.2.3  Baseline Wander Correction
      4. 5.2.4  NRZI and MLT-3 Decoding
      5. 5.2.5  Descrambler
      6. 5.2.6  5B/4B Decoder and Nibble Alignment
      7. 5.2.7  Timing Loop and Clock Recovery
      8. 5.2.8  Phase-Locked Loops (PLL)
      9. 5.2.9  Link Monitor
      10. 5.2.10 Signal Detect
      11. 5.2.11 Bad SSD Detection
    3. 5.3 10Base-T Receive Path
      1. 5.3.1 10M Receive Input and Squelch
      2. 5.3.2 Collision Detection
      3. 5.3.3 Carrier Sense
      4. 5.3.4 Jabber Function
      5. 5.3.5 Automatic Link Polarity Detection and Correction
      6. 5.3.6 10Base-T Transmit and Receive Filtering
      7. 5.3.7 10Base-T Operational Modes
    4. 5.4 Auto Negotiation
      1. 5.4.1 Operation
      2. 5.4.2 Initialization and Restart
      3. 5.4.3 Next Page Support
    5. 5.5 Link Down Functionality
  6. 6 Reset and Power Down Operation
    1. 6.1 Hardware Reset
    2. 6.2 Software Reset
    3. 6.3 Power Down/Interrupt
      1. 6.3.1 Power Down Control Mode
      2. 6.3.2 Interrupt Mechanisms
    4. 6.4 Power Save Modes
  7. 7 Design Guidelines
    1. 7.1 TPI Network Circuit
    2. 7.2 Clock In (XI) Requirements
      1. 7.2.1 Oscillator
      2. 7.2.2 Crystal
    3. 7.3 Thermal Vias Recommendation
  8. 8 Register Block
    1. 8.1 Register Definition
      1. 8.1.1  Basic Mode Control Register (BMCR)
      2. 8.1.2  Basic Mode Status Register (BMSR)
      3. 8.1.3  PHY Identifier Register 1 (PHYIDR1)
      4. 8.1.4  PHY Identifier Register 2 (PHYIDR2)
      5. 8.1.5  Auto-Negotiation Advertisement Register (ANAR)
      6. 8.1.6  Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
      7. 8.1.7  Auto-Negotiate Expansion Register (ANER)
      8. 8.1.8  Auto-Negotiate Next Page Transmit Register (ANNPTR)
      9. 8.1.9  Auto-Negotiation Link Partner Ability Next Page Register (ANLNPTR)
      10. 8.1.10 Control register 1 (CR1)
      11. 8.1.11 Control register 2 (CR2)
      12. 8.1.12 Control Register 3 (CR3)
      13. 8.1.13 Extended Register Addressing
        1. 8.1.13.1 Register Control Register (REGCR)
        2. 8.1.13.2 Address or Data Register (ADDAR)
      14. 8.1.14 PHY Status Register (PHYSTS)
      15. 8.1.15 PHY Specific Control Register (PHYSCR)
      16. 8.1.16 MII Interrupt Status Register 1 (MISR1)
      17. 8.1.17 MII Interrupt Status Register 2 (MISR2)
      18. 8.1.18 False Carrier Sense Counter Register (FCSCR)
      19. 8.1.19 Receiver Error Counter Register (RECR)
      20. 8.1.20 BIST Control Register (BISCR)
      21. 8.1.21 RMII Control and Status Register (RCSR)
      22. 8.1.22 LED Control Register (LEDCR)
      23. 8.1.23 PHY Control Register (PHYCR)
      24. 8.1.24 10Base-T Status/Control Register (10BTSCR)
      25. 8.1.25 BIST Control and Status Register 1 (BICSR1)
      26. 8.1.26 BIST Control and Status Register2 (BICSR2)
    2. 8.2 Cable Diagnostic Control Register (CDCR)
    3. 8.3 PHY Reset Control Register (PHYRCR)
    4. 8.4 Compliance Test register (COMPTR)
    5. 8.5 TX_CLK Phase Shift Register (TXCPSR)
    6. 8.6 Power Back Off Control Register (PWRBOCR)
    7. 8.7 Voltage Regulator Control Register (VRCR)
    8. 8.8 Cable Diagnostic Configuration/Result Registers
      1. 8.8.1  ALCD Control and Results 1 (ALCDRR1)
      2. 8.8.2  Cable Diagnostic Specific Control Registers (CDSCR1 - CDSCR4)
      3. 8.8.3  Cable Diagnostic Location Results Register 1 (CDLRR1)
      4. 8.8.4  Cable Diagnostic Location Results Register 2 (CDLRR2)
      5. 8.8.5  Cable Diagnostic Location Results Register 3 (DDLRR3)
      6. 8.8.6  Cable Diagnostic Location Results Register 4 (CDLRR4)
      7. 8.8.7  Cable Diagnostic Location Results Register 5 (CDLRR5)
      8. 8.8.8  Cable Diagnostic Amplitude Results Register 1 (CDARR1)
      9. 8.8.9  Cable Diagnostic Amplitude Results Register 2 (CDARR2)
      10. 8.8.10 Cable Diagnostic Amplitude Results Register 3 (CDARR3)
      11. 8.8.11 Cable Diagnostic Amplitude Results Register 4 (CDARR4)
      12. 8.8.12 Cable Diagnostic Amplitude Results Register 5 (CDARR5)
      13. 8.8.13 Cable Diagnostic General Results Register (CDGRR)
      14. 8.8.14 ALCD Control and Results 2 (ALCDRR2)
  9. 9 Electrical Specifications
    1. 9.1 Absolute Maximum Ratings
    2. 9.2 ESD Ratings
    3. 9.3 Recommended Operating Conditions
    4. 9.4 145
      1. 9.4.1 TLK105 32-Pin Industrial Device (85°C) Thermal Characteristics
    5. 9.5 TLK106 32-Pin Extended Temperature (105°C) Device Thermal Characteristics
    6. 9.6 DC Characteristics, VDD_IO
    7. 9.7 DC Characteristics
    8. 9.8 Power Supply Characteristics
      1. 9.8.1 Active Power, Single Supply Operation
      2. 9.8.2 Active Power, Dual Supply Operation
      3. 9.8.3 Power-Down Power
    9. 9.9 AC Specifications
      1. 9.9.1  Power Up Timing
      2. 9.9.2  Reset Timing
      3. 9.9.3  MII Serial Management Timing
      4. 9.9.4  100Mb/s MII Transmit Timing
      5. 9.9.5  100Mb/s MII Receive Timing
      6. 9.9.6  100Base-TX Transmit Packet Latency Timing
      7. 9.9.7  100Base-TX Transmit Packet Deassertion Timing
      8. 9.9.8  100Base-TX Transmit Timing (tR/F and Jitter)
      9. 9.9.9  100Base-TX Receive Packet Latency Timing
      10. 9.9.10 100Base-TX Receive Packet Deassertion Timing
      11. 9.9.11 10Mbs MII Transmit Timing
      12. 9.9.12 10Mb/s MII Receive Timing
      13. 9.9.13 10Base-T Transmit Timing (Start of Packet)
      14. 9.9.14 10Base-T Transmit Timing (End of Packet)
      15. 9.9.15 10Base-T Receive Timing (Start of Packet)
      16. 9.9.16 10Base-T Receive Timing (End of Packet)
      17. 9.9.17 10Mb/s Jabber Timing
      18. 9.9.18 10Base-T Normal Link Pulse Timing
      19. 9.9.19 Auto-Negotiation Fast Link Pulse (FLP) Timing
      20. 9.9.20 100Base-TX Signal Detect Timing
      21. 9.9.21 100Mbs Loopback Timing
      22. 9.9.22 10Mbs Internal Loopback Timing
      23. 9.9.23 RMII Transmit Timing
      24. 9.9.24 RMII Receive Timing
      25. 9.9.25 Isolation Timing
  10. 10Revision History

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Reset and Power Down Operation

The TLK10x includes an internal power-on-reset (POR) function, and therefore does not need an explicit reset for normal operation after power up.

At power-up, if required by the system, the RESET pin (active low) should be de-asserted 200µs after the power is ramped up to allow the internal circuits to settle and for the internal regulators to stabilize. If required during normal operation, the device can be reset by a hardware or software reset.

6.1 Hardware Reset

A hardware reset is accomplished by applying a low pulse (TTL level), with a duration of at least 1μs, to RESET. This pulse resets the device such that all registers are reinitialized to default values, and the hardware configuration values are re-latched into the device (similar to the power-up/reset operation). The time from the point when the reset pin is de-asserted to the point when the reset has concluded internally is approximately 200µs.

6.2 Software Reset

An IEEE registers software reset is accomplished by setting the reset bit (bit 15) of the BMCR register (0x0000h). This bit only resets the IEEE-defined standard registers in the address space 0x00h to 0x07h.

A global software reset is accomplished by setting bit 15 of register PHYRCR (0x001F) to ‘1’. This bit resets all the internal circuits in the PHY including IEEE-defined registers (0x00h to 0x07h) and all the extended registers. The global software reset resets the device such that all registers are reset to default values and the hardware configuration values are maintained.

A global software restart is accomplished by setting bit 14 of register PHYRCR (0x001F) to ‘1’. This action resets all the PHY circuits except the registers in the Register File.

The time from the point when the resets/restart bits are set to the point when the software resets/restart has concluded is approximately 200µs. TI recommends that the software driver code must wait 500µs following software reset before allowing further serial MII operations with the TLK10x.

6.3 Power Down/Interrupt

The Power Down and Interrupt functions are multiplexed on pin 8 of the device. By default, this pin functions as a power down input and the interrupt function is disabled. This pin can be configured as an interrupt output pin by setting bit 0 (INT_OE) to ‘1’ in the PHYSCR (0x0011h) register. The PHYSCR register is also used to enable and set the polarity of the interrupt.

6.3.1 Power Down Control Mode

The INT/PWDN pin can be asserted low to put the device in a Power Down mode. An external control signal can be used to drive the pin low, overcoming the weak internal pull-up resistor. Alternatively, the device can be configured to initialize into a Power Down state by use of an external pulldown resistor on the INT/PWDN pin.

6.3.2 Interrupt Mechanisms

The interrupt function is controlled via register access. All interrupt sources are disabled by default. The MISR1 (0x0012) and MISR2 (0x0013) registers provide independent interrupt enable bits for the various interrupts supported by the TLK10x. The INT/PWDN pin is asynchronously asserted low when an interrupt condition occurs. The source of the interrupt can be determined by reading the interrupt status registers MISR1 (0x0012h) and MISR2 (0x0013). One or more bits in the MISR registers will be set, indicating all currently-pending interrupts. Reading the MISR registers clears ALL pending interrupts.

6.4 Power Save Modes

The TLK10x supports three types of power-save modes. The lowest power consumption is achieved in IEEE power down mode. To enter IEEE power down mode, pull the INT/PWDN pin to LOW or program bit 11 in the Basic Mode Control Register (BMCR), address 0x0000. In this mode all internal circuitry except SMI functionality is shut down (Register access is still available).

To enable and activate all other power save modes through register access, use register PHYSCR (0x0011h). Setting bit 14 enables all power-save modes; bits [13:12] select between them.

Setting bits [13:12] to “01” powers down the PHY, forcing it into IEEE power down mode (Similar to BMCR bit 11 functionality).

Setting bits [13:12] to “10” puts the PHY in Low Power Active Energy Saving mode.

Setting bits [13:12] to “11” puts the PHY in Low Power Passive Energy Saving mode.

When these bits are cleared, the PHY powers up and returns to the last state it was in before it was powered down.