SGLS307Q
July 2006 – August 2024
TLK2711-SP
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
TTL Input Electrical Characteristics
5.6
Transmitter/Receiver Electrical Characteristics
5.7
Reference Clock (TXCLK) Timing Requirements
5.8
TTL Output Switching Characteristics
5.9
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Transmit Interface
6.3.2
Transmit Data Bus
6.3.3
Data Transmission Latency
6.3.4
8-Bit/10-Bit Encoder
6.3.5
Pseudo-Random Bit Stream (PRBS) Generator
6.3.6
Parallel to Serial
6.3.7
High-Speed Data Output
6.3.8
Receive Interface
6.3.9
Receive Data Bus
6.3.10
Data Reception Latency
6.3.11
Serial to Parallel
6.3.12
Comma Detect and 8-Bit/10-Bit Decoding
6.3.13
LOS Detection
6.3.14
PRBS Verification
6.3.15
Reference Clock Input
6.3.16
Operating Frequency Range
6.3.17
Testability
6.3.18
Loopback Testing
6.3.19
BIST
6.3.20
Power-On Reset
6.4
Device Functional Modes
6.4.1
Power-Down Mode
6.4.2
High-Speed I/O Directly-Coupled Mode
6.4.3
High-Speed I/O AC-Coupled Mode
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Receiving Notification of Documentation Updates
8.2
Support Resources
8.3
Trademarks
8.4
Electrostatic Discharge Caution
8.5
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
HFG|68
MCQF014F
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sgls307q_oa