SLOS197B August   1997  – July 2025 TLV2721

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics VS = 3V
    5. 5.5 Electrical Characteristics VS = 5V
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving Large Capacitive Loads
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) TLV2721 UNIT
DBV (SOT5-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 192.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance  113.6 °C/W
RθJB Junction-to-board thermal resistance 60.5 °C/W
ψJT Junction-to-top characterization parameter 37.2 °C/W
ψJB Junction-to-board characterization parameter 60.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.