SBOS300C february 2004 – april 2023 TLV3011 , TLV3011B , TLV3012 , TLV3012B
PRODUCTION DATA
THERMAL METRIC(1) | TLV3011B, TLV3012B | UNIT | ||
---|---|---|---|---|
DCK (SC-70) |
DBV (SOT-23) |
|||
6 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 169.8 | 162.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 120.5 | 78.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 63.2 | 42.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 45.9 | 21.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 63.0 | 41.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | °C/W |