13.1 Layout Guidelines
PCB design is made considering the application, and the review is specific for each system requirements. However, general considerations can optimize the system performance.
- The TLV320AIC3105 thermal pad should be connected to analog output driver ground using multiple VIAS to minimize impedance between the device and ground.
- Analog and digital grounds should be separated to prevent possible digital noise from affecting the analog performance of the board.
- The TLV320AIC3105 requires the decoupling capacitors to be placed as close as possible to the device power supply terminals.
- If possible, route the differential audio signals differentially on the PCB. This is recommended to get better noise immunity.