SBOSAA8B December   2022  – September 2023 TLV2365 , TLV365

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input
      2. 8.3.2 Input and ESD Protection
      3. 8.3.3 Driving Capacitive Loads
      4. 8.3.4 Active Filter
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Overdrive Recovery Performance
      2. 9.1.2 Achieving an Output Level of Zero Volts
    2. 9.2 Typical Applications
      1. 9.2.1 Second-Order Low-Pass Filter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 ADC Driver and Reference Buffer
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
        2. 10.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 10.1.1.3 DIP-Adapter-EVM
        4. 10.1.1.4 DIYAMP-EVM
        5. 10.1.1.5 TI Reference Designs
        6. 10.1.1.6 Filter Design Tool
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-EE2AB349-4DA3-47CD-B280-08217BB9651E-low.gif Figure 6-1 TLV365 DBV Package, 5-Pin SOT-23 (Top View)
Table 6-1 Pin Functions: TLV365
PIN TYPE DESCRIPTION
NAME NO.
–IN 4 Input Negative (inverting) input
+IN 3 Input Positive (noninverting) input
V– 2 — Negative (lowest) power supply
V+ 5 — Positive (highest) power supply
VOUT 1 Output Output
GUID-8227EF26-4791-4DBC-91C8-7DAF070800F5-low.gif Figure 6-2 TLV2365 D Package, 8-Pin SOIC (Top View)
Pin Functions: TLV2365
PIN TYPE DESCRIPTION
NAME NO.
–IN A 2 Input Negative (inverting) input signal, channel A
+IN A 3 Input Positive (noninverting) input signal, channel A
–IN B 6 Input Negative (inverting) input signal, channel B
+IN B 5 Input Positive (noninverting) input signal, channel B
V– 4 — Negative (lowest) power supply
V+ 8 — Positive (highest) power supply
VOUTA 1 Output Output, channel A
VOUTB 7 Output Output, channel B