SBVS404A April   2020  – June 2020 TLV4062 , TLV4082

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Block Diagram for TLV4062
      2.      Block Diagram for TLV4082
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs (IN1, IN2)
      2. 7.4.2 Outputs (OUT1, OUT2)
      3. 7.4.3 Switching Threshold and Hysteresis
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Threshold Overdrive
    2. 8.2 Typical Applications
      1. 8.2.1 Monitoring Two Separate Rails
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Early Warning Detection
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Additional Application Information
        1. 8.2.3.1 Pull-Up Resistor Selection
        2. 8.2.3.2 INx Capacitor
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Related Links
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Timing Requirements

typical values are at TJ = 25°C and VDD = 3.3 V; INx transitions between 0 V and 1.3 V
MIN NOM MAX UNIT
tPD(r) INx (rising) to OUTx propagation delay 5.5 µs
tPD(f) INx (falling) to OUTx propagation delay 10 µs
tSD Startup delay(1) 570 µs
During power-on or when a VDD transient is below VDD(min), the outputs reflect the input conditions 570 µs after VDD transitions through VDD(min).
TLV4062 TLV4082 timing_di_sbvs250.gifFigure 1. Timing Diagram