SLVSDG1C DECEMBER 2016 – October 2017 TLV62569
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
The PCB layout is an important step to maintain the high performance of the TLV62569 device.
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, convection surfaces, and the presence of other heat-generating components affect the power dissipation limits of a given component.
Two basic approaches for enhancing thermal performance are listed below: