SLVSDM5F September   2017  – March 2020 TLV7011 , TLV7012 , TLV7021 , TLV7022

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      X2SON Package vs SC70 and US Dime
      2.      Propagation Delay vs. Overdrive
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions: TLV7012/22
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings (Single)
    2. 6.2  Absolute Maximum Ratings (Dual)
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions (Single)
    5. 6.5  Recommended Operating Conditions (Dual)
    6. 6.6  Thermal Information (Single)
    7. 6.7  Thermal Information (Dual)
    8. 6.8  Electrical Characteristics (Single)
    9. 6.9  Switching Characteristics (Single)
    10. 6.10 Electrical Characteristics (Dual)
    11. 6.11 Switching Characteristics (Dual)
    12. 6.12 Timing Diagrams
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inverting Comparator With Hysteresis for TLV701x
      2. 8.1.2 Noninverting Comparator With Hysteresis for TLV701x
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IR Receiver Analog Front End
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Square-Wave Oscillator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Thermal Information (Dual)

THERMAL METRIC(1) TLV7012/TLV7022 UNIT
DGK (VSSOP) DDF (SOT-23) DSG (WSON)
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 211.7 212.5 106.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 96.1 127.3 127.3 °C/W
RθJB Junction-to-board thermal resistance 133.5 129.2 72.5 °C/W
ΨJT Junction-to-top characterization parameter 28.3 25.8 16.8 °C/W
ΨJB Junction-to-board characterization parameter 131.7 129.0 72.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 47.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.