SLVSK31 June   2026 TLV9023L

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1.     Pin Configurations:TLV9023L
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Outputs
        1. 6.4.1.1 Comparator Open-Drain Outputs
        2. 6.4.1.2 AND_OUT Output
      2. 6.4.2 Power-On Reset (POR)
        1. 6.4.2.1 Output POR Behavior
      3. 6.4.3 Output Latching
        1. 6.4.3.1 TLV9023L Latch Behavior
        2. 6.4.3.2 Clear (CLR) Input
      4. 6.4.4 Inputs
        1. 6.4.4.1 Rail to Rail Input
        2. 6.4.4.2 Fail-Safe Inputs
        3. 6.4.4.3 Input Protection
        4. 6.4.4.4 Internal Hysteresis
        5. 6.4.4.5 AND_IN Input
        6. 6.4.4.6 Unused Inputs
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
    2. 7.2 Typical Application
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

DATE REVISION NOTES
June 2026 * Initial Release