SBOSAH8B February   2024  – May 2024 TLV9051-Q1 , TLV9052-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8V to 5.5V
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Operating Voltage
      2. 6.3.2 Rail-to-Rail Input
      3. 6.3.3 Rail-to-Rail Output
      4. 6.3.4 EMI Rejection
      5. 6.3.5 Overload Recovery
      6. 6.3.6 Electrical Overstress
      7. 6.3.7 Input Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Low-Side Current Sense Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.2 Detailed Design Procedure

The transfer function of the circuit in Figure 7-1 is given in Equation 1.

Equation 1. V O U T = I L O A D × R S H U N T × G a i n

The load current (ILOAD) produces a voltage drop across the shunt resistor (RSHUNT). The load current is set from 0A to 1A. To keep the shunt voltage below 100mV at maximum load current, the largest shunt resistor is defined using Equation 2.

Equation 2. R S H U N T =   V S H U N T _ M A X I L O A D _ M A X =   100   m V 1   A = 100   m Ω

Using Equation 2, RSHUNT equals 100mΩ. The voltage drop produced by ILOAD and RSHUNT is amplified by the TLV905x-Q1 device to produce an output voltage of approximately 0V to 4.95V. Equation 3 calculates the gain required for the TLV905x-Q1 device to produce the required output voltage.

Equation 3. G a i n =   ( V O U T _ M A X   –   V O U T M I N ) ( V I N _ M A X   –   V I N _ M I N )

Using Equation 3, the required gain equals 49.5V/V, which is set with the RF and RG resistors. Equation 4 sizes the RF and RG, resistors to set the gain of the TLV905x-Q1 device to 49.5V/V.

Equation 4. G a i n = 1 + ( R F ) ( R G )

Selecting RF to equal 165kΩ and RG to equal 3.4kΩ provides a combination that equals approximately 49.5V/V. Figure 7-2 shows the measured transfer function of the circuit shown in Figure 7-1.