SBOSA67B November   2021  – March 2022 TLV9361 , TLV9362 , TLV9364

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 EMI Rejection
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 Electrical Overstress
      5. 7.3.5 Overload Recovery
      6. 7.3.6 Typical Specifications and Distributions
    4. 7.4 Device Functional Modes
  8. Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Unity-Gain Buffer With RISO Stability Compensation
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Protection

The internal power dissipation of any amplifier causes its internal (junction) temperature to rise. This phenomenon is called self heating. The absolute maximum junction temperature of the TLV936x is 150°C. Exceeding this temperature causes damage to the device. The TLV936x has a thermal protection feature that reduces damage from self heating. The protection works by monitoring the temperature of the device and turning off the op amp output drive for temperatures above 170°C. Figure 7-2 shows an application example for the TLV9362 that has significant self heating because of its power dissipation (0.954 W). In this example, both channels have a quiescent power dissipation while one of the channels has a significant load. Thermal calculations indicate that for an ambient temperature of 55°C, the device junction temperature reaches 180°C. The actual device, however, turns off the output drive to recover towards a safe junction temperature. Figure 7-2 shows how the circuit behaves during thermal protection. During normal operation, the device acts as a buffer so the output is 3 V. When self heating causes the device junction temperature to increase above the internal limit, the thermal protection forces the output to a high-impedance state and the output is pulled to ground through resistor RL. If the condition that caused excessive power dissipation is not removed, the amplifier will oscillate between a shutdown and enabled state until the output fault is corrected. Please note that thermal performance can vary greatly depending on the package selected and the PCB layout design. This example uses the thermal performance of the SOIC (8) package.

Figure 7-2 Thermal Protection