SLVS555M November   2004  – January 2023 TLVH431 , TLVH431A , TLVH431B , TLVH432 , TLVH432A , TLVH432B

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 TLVH43x Electrical Characteristics
    6. 6.6 TLVH43xA Electrical Characteristics
    7. 6.7 TLVH43xB Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Open Loop (Comparator)
      2. 8.4.2 Closed Loop
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Comparator With Integrated Reference (Open Loop)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Basic Operation
          2. 9.2.1.2.2 Overdrive
          3. 9.2.1.2.3 Output Voltage and Logic Input Level
            1. 9.2.1.2.3.1 Input Resistance
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Shunt Regulator/Reference
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output/Cathode Voltage
          2. 9.2.2.2.2 Total Accuracy
          3. 9.2.2.2.3 Stability
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Related Links
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision L (April 2020) to Revision M (January 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Modified Device Information tableGo

Changes from Revision K (September 2016) to Revision L (April 2020)

  • Added links to applications on TI.com Go
  • Changed Thermal InformationGo
  • Changed load capacitance value to better reflect the device behaviorGo

Changes from Revision J (January 2015) to Revision K (September 2016)

  • Changed data sheet titleGo
  • Updated pinout images and Pin Functions tableGo
  • Deleted D package from Pin Functions tableGo

Changes from Revision I (September 2009) to Revision J (January 2015)

  • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Deleted Ordering Information table.Go