SLYS052A March   2023  – December 2023 TMAG5170D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Magnetic Characteristics
    7. 5.7 Power up Timing
    8. 5.8 SPI Interface Timing
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Magnetic Range Selection
      4. 6.3.4 Update Rate Settings
      5. 6.3.5 ALERT Function
        1. 6.3.5.1 Interrupt and Trigger Mode
        2. 6.3.5.2 Magnetic Switch Mode
      6. 6.3.6 Threshold Count
      7. 6.3.7 Diagnostics
        1. 6.3.7.1  Memory Cyclic Redundancy Check (CRC)
        2. 6.3.7.2  ALERT Integrity Check
        3. 6.3.7.3  VCC Check
        4. 6.3.7.4  Internal LDO Undervoltage Check
        5. 6.3.7.5  Digital Core Power-On Reset Check
        6. 6.3.7.6  SDO Output Check
        7. 6.3.7.7  Communication Cyclic Redundancy Check (CRC)
        8. 6.3.7.8  Oscillator Integrity Check
        9. 6.3.7.9  Magnetic Field Threshold Check
        10. 6.3.7.10 Temperature Alert Check
        11. 6.3.7.11 Analog Front-End (AFE) Check
        12. 6.3.7.12 Hall Resistance and Switch Matrix Check
        13. 6.3.7.13 Hall Offset Check
        14. 6.3.7.14 ADC Check
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
        1. 6.4.1.1 Active Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Configuration Mode (DEFAULT)
        4. 6.4.1.4 Sleep Mode
        5. 6.4.1.5 Wake-Up and Sleep Mode
        6. 6.4.1.6 Deep-Sleep Mode
    5. 6.5 Programming
      1. 6.5.1 Data Definition
        1. 6.5.1.1 Magnetic Sensor Data
        2. 6.5.1.2 Temperature Sensor Data
        3. 6.5.1.3 Magnetic Sensor Offset Correction
        4. 6.5.1.4 Angle and Magnitude Data Definition
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SCK
        2. 6.5.2.2 CS
        3. 6.5.2.3 SDI
        4. 6.5.2.4 SDO
          1. 6.5.2.4.1 Regular 32-Bit SDO Read
          2. 6.5.2.4.2 Special 32-Bit SDO Read
        5. 6.5.2.5 SPI CRC
        6. 6.5.2.6 SPI Frame
          1. 6.5.2.6.1 32-Bit Read Frame
          2. 6.5.2.6.2 32-Bit Write Frame
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Selecting the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
        1. 7.1.3.1 Continuous Conversion
        2. 7.1.3.2 Trigger Conversion
        3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Error Calculation During Linear Measurement
      5. 7.1.5 Error Calculation During Angular Measurement
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Gain Adjustment for Angle Measurement
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Map
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

Over TA = –40°C to 125°C range and VCC = 2.3 V to 5.5 V (unless otherwise noted); Typical specification are at TA = 25°C and VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Digital Input/Output
VIH Input logic high voltage, SDI1, CS1, SCK1, SDI2, CS2, SCK2 0.75 * VCC V
VIL Input logic low voltage, SDI1, CS1, SCK1, ALERT1, SDI2, CS2, SCK2, ALERT2 0.25 * VCC V
VOH Output HIGH voltage, SDOx pins IOUT = 2 mA VCC –0.4 VCC V
VOL Output LOW voltage, SDOx pins IOUT = -2 mA 0 0.4 V
VOL Output LOW voltage, ALERTx  pins IOUT = -2 mA 0 0.4 V
tFALL_ALERT ALERTx output fall time RPU = 10 kΩ
CL = 20 pF		 50 ns
tALERT ALERTx output pulse width with conversion complete or threshold cross interrupt event ALERT_MODE = 0h
Interrupt & Trigger Mode		 5 µs
tALERT ALERTx output pulse width with other interrupt events  ALERT_MODE = 0h
Interrupt & Trigger Mode		 31 µs
IOZ Output Leakage current, ALERTx pins ALERT pin disabled
VOZ = 5.5 V		 0 30 100 nA
Power Supply
VCC_PORRise Power on reset voltage at VCCx ramping up 1.15 1.4 1.7 V
VCC_PORFall Power off reset voltage at VCCx ramping down 0.8 1.2 1.6 V
VCC_UV Under voltage threshold at VCCx 2.0 2.1 2.3 V
VCC_OV Over voltage threshold at VCCx 5.57 5.9 6.9 V
IACTIVE Active mode current from VCC1 or VCC2 CS high 3.4 4.5 mA
ISTDBY Stand-by mode current from VCC1 or VCC2 CS high 0.8 1.2 mA
ICFG Configuration mode current from VCC1 or VCC2 CS high 0.06 0.15 mA
ISLP Sleep mode current from VCC1 or VCC2 CS high 1.3 45 µA
IDEEP_SLP Deep sleep mode current from VCC1 or VCC2 CS high 5 300 nA
ICC_DCM Duty-cycle mode current consumption for each die
One channel enabled
CONV_AVG = 0h		 Data active rate 1000 Hz 290 µA
Data active rate 100 Hz 34 µA
Data active rate 10 Hz 4.5 µA
Data active rate 1 Hz 2.2 µA
Duty-cycle mode current consumption  for each die
Two channels enabled
CONV_AVG = 0h		 Data active rate 1000 Hz 360 µA
Data active rate 100 Hz 43 µA
Data active rate 10 Hz 5 µA
Data active rate 1 Hz 2.3 µA
Operating Speed
tw_trigger Pulse width for conversion trigger input signal 15 µs
tmeasure Conversion time (1)
OPERATING_MODE = 2h
One channel enabled 		 CONV_AVG = 0h(2) 50 µs
CONV_AVG = 5h(3) 825 µs
fHFOSC Internal high-frequency oscillator speed 2.95 3.2 3.5 MHz
fLFOSC Internal low-frequency oscillator speed 13.5 16 19.5 KHz
Temperature Sensing
TSENS_T0 Reference temperature for TADCT0 20.5 25 29.5 ℃
TADCT0 TEMP_RESULT decimal value @ TSENS_T0 17522
TADCRES Temp sensing resolution 58.2 60.0 61.8 LSB/℃
NRMS (T) RMS (1 Sigma) temperature noise CONV_AVG = 5h 0.06 ℃
CONV_AVG = 0h 0.35 ℃
Sensor Location
ds1_s2  Sensor displacement in the X and Y plane 25 75 µm
As1_s2 Relative angular rotation between top and bottom sensor in degree 1 3 deg
(1) To calculate the time between conversion request and the availability of the conversion result, add the initialization time to the tmeasure as explained in Comparing Operating Modes Table. For continuous conversion, the initialization time is applicable only for the first conversion.
(2) Add 25 µs for each additional channel enabled for conversion with CONV_AVG = 0h.
(3) For conversion with CONV_AVG = 5h, each axis data is collected 32 times. If an additional channel is enabled with CONV_AVG = 5h, add 32×25 µs = 80 0µs to the tmeasure to calculate the conversion time for two axes.