SLYS045B June   2021  – July 2024 TMAG5273

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Temperature Sensor
    7. 5.7  Magnetic Characteristics For A1, B1, C1, D1
    8. 5.8  Magnetic Characteristics For A2, B2, C2, D2
    9. 5.9  Magnetic Temp Compensation Characteristics
    10. 5.10 I2C Interface Timing
    11. 5.11 Power up & Conversion Time
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Interrupt Function
      4. 6.3.4 Device I2C Address
      5. 6.3.5 Magnetic Range Selection
      6. 6.3.6 Update Rate Settings
    4. 6.4 Device Functional Modes
      1. 6.4.1 Standby (Trigger) Mode
      2. 6.4.2 Sleep Mode
      3. 6.4.3 Wake-up and Sleep (W&S) Mode
      4. 6.4.4 Continuous Measure Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 SCL
        2. 6.5.1.2 SDA
        3. 6.5.1.3 I2C Read/Write
          1. 6.5.1.3.1 Standard I2C Write
          2. 6.5.1.3.2 General Call Write
          3. 6.5.1.3.3 Standard 3-Byte I2C Read
          4. 6.5.1.3.4 1-Byte I2C Read Command for 16-Bit Data
          5. 6.5.1.3.5 1-Byte I2C Read Command for 8-Bit Data
          6. 6.5.1.3.6 I2C Read CRC
      2. 6.5.2 Data Definition
        1. 6.5.2.1 Magnetic Sensor Data
        2. 6.5.2.2 Temperature Sensor Data
        3. 6.5.2.3 Angle and Magnitude Data Definition
        4. 6.5.2.4 Magnetic Sensor Offset Correction
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Select the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
        1. 7.1.3.1 Continuous Conversion
        2. 7.1.3.2 Trigger Conversion
        3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Magnetic Limit Check
      5. 7.1.5 Error Calculation During Linear Measurement
      6. 7.1.6 Error Calculation During Angular Measurement
    2. 7.2 Typical Application
      1. 7.2.1 Magnetic Tamper Detection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 I2C Address Expansion
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 Angle Measurement
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
          1. 7.2.3.2.1 Gain Adjustment for Angle Measurement
        3. 7.2.3.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Maps
    1. 8.1 TMAG5273 Registers
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SDA, INT
VOL Output LOW voltage, SDA, INT pin IOUT = 2mA 0 0.4 V
IOZ Output leakage current, SDA, INT pin Output disabled, VOZ = 5.5V ±100 nA
tFALL_INT INT output fall time RPU =10KΩ, CL =20pF, VPU =1.65V to 5.5V 6 ns
tINT (INT) INT Interrupt  time duration during pulse mode INT_MODE =001b or 010b 10 µs
tINT (SCL) SCL Interrupt  time duration INT_MODE =011b or 100b 10 µs
DC POWER SECTION
VCCUV(1) Undervoltage threshold at VCC VCC = 2.3V to 3.6V 1.9 2.0 2.2 V
IACTIVE Active mode current  X, Y, Z, or thermal sensor active conversion, LP_LN =0b 2.3 mA
IACTIVE Active mode current  X, Y, Z, or thermal sensor active conversion, LP_LN =1b 3.0 mA
ISTANDBY Stand-by mode current Device in trigger mode, no conversion started 0.45 mA
ISLEEP Sleep mode current 5 nA
AVERAGE POWER DURING WAKE-UP AND SLEEP (W&S) MODE
ICC_DCM
 W&S mode current consumption
Wake-up interval 1ms
LP_LN =0b		 Magnetic 1 channel conversion
VCC =3.3V		 160 µA
Magnetic 1 channel conversion
VCC =1.8V		 156 µA
Magnetic 4 channel conversion
VCC =3.3V		 240 µA
Magnetic 4 channel conversion
VCC =1.8V		 233 µA
W&S mode current consumption
Wake-up interval 5000ms
LP_LN =0b		 Magnetic 1 channel conversion
VCC =3.3V		 1.21 µA
Magnetic 1 channel conversion
VCC =1.8V		 1.00 µA
Magnetic 4 channel conversion
VCC =3.3V		 1.22 µA
Magnetic 4-channel conversion
VCC =1.8V		 1.02 µA
(1) The DIAG_STATUS and VCC_UV_ER bits are not valid for VCC < 2.3V