SLYS044A December   2021  – June 2022 TMAG5328

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Magnetic Flux Direction
      2. 7.3.2 Magnetic Response
      3. 7.3.3 Output Type
      4. 7.3.4 Sampling Rate
      5. 7.3.5 Adjustable Threshold
        1. 7.3.5.1 Adjustable Resistor
        2. 7.3.5.2 Adjustable Voltage
      6. 7.3.6 Hall Element Location
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Type Tradeoffs
      2. 8.1.2 Valid TMAG5328 Configurations
    2. 8.2 Typical Applications
      1. 8.2.1 Refrigerator Door Open/Close Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TMAG5328 UNIT
SOT-23 (DBV)
6 PINS
RθJA Junction-to-ambient thermal resistance 167.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84.1 °C/W
RθJB Junction-to-board thermal resistance 52.2 °C/W
ΨJT Junction-to-top characterization parameter 32 °C/W
ΨJB Junction-to-board characterization parameter 51.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.