SBOS518E May   2011  – April 2015 TMP006

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Responsivity
      2. 8.3.2 Field of View and Angular Response
      3. 8.3.3 Thermopile Principles and Operation
      4. 8.3.4 Object Temperature Calculation
      5. 8.3.5 Calibration
      6. 8.3.6 Sensor Voltage Format
      7. 8.3.7 Temperature Format
      8. 8.3.8 Serial Interface
        1. 8.3.8.1 Serial Bus Address
        2. 8.3.8.2 Read and Write Operations
        3. 8.3.8.3 Two-Wire Timing Diagrams
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 Sensor Voltage Result (VSENSOR) Register (address = 00h) [reset = 0000000000000000]
      2. 8.5.2 Temperature (TDIE) Register (address = 01h) [reset = 0000000000000000]
      3. 8.5.3 Configuration Register (address = 02h) [reset = 0111010000000000]
      4. 8.5.4 Manufacturer and Device ID Registers
        1. 8.5.4.1 Manufacturer ID Register (address = FEh) [reset = 0101010001001001]
        2. 8.5.4.2 Device ID Register (address = FFh) [reset = 0000000001100111]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common vs Unit Calibration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Wide-Range Calibration
          2. 9.2.1.2.2 Verifying the Calibration
        3. 9.2.1.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Use of NEP, NETD, and Responsivity in Estimating System Performance
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VS V+ pin 7 V
Input voltage ADR1 pins –0.5 VS + 0.5 V
SDA, SCL, DRDY, ADR0 pins –0.5 +7 V
Input current 10 mA
Temperature Operating range –40 +125 °C
Junction temperature, TJ max +150 °C
Storage range, Tstg –65 +150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
Machine model ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage, VS 2.5 3.3 5.5 V
Operating temperature range –40 +125 °C
Die temperature, TDIE 125 °C
Object temperature, TOBJ See note (1) °C
(1) Object temperature is application dependent.

7.4 Thermal Information

THERMAL METRIC(1) TMP006
TMP006B		 UNIT
YZF (DSBGA)
8 PINS
RθJA Junction-to-ambient thermal resistance 123.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 69
RθJB Junction-to-board thermal resistance 103
ψJT Junction-to-top characterization parameter 4.7
ψJB Junction-to-board characterization parameter 55
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

At TDIE = +25°C, V+ = 3.3 V, and conversion time = 1 second, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OUTPUT ERROR
Die temperature sensor TDIE = 0°C to +60°C, V+ = 2.2 V to 5.5 V ±0.5 ±1 °C
TDIE = –40°C to +125°C, V+ = 2.2 V to 5.5 V ±0.5 ±1.5 °C
PSRR Power-supply rejection ratio 0.1 °C/V
Calculate object temperature(1) TDIE = +20°C to +60°C,
TOBJ – TDIE = –10°C to +30°C		 ±1 ±3 °C
Field of view 50% responsivity 90 Degrees
TEMPERATURE MEASUREMENT
Conversion time CR2 = 0, CR1 = 0, CR0 = 0 0.25 Seconds
CR2 = 0, CR1 = 0, CR0 = 1 0.5 Seconds
CR2 = 0, CR1 = 1, CR0 = 0 1 Seconds
CR2 = 0, CR1 = 1, CR0 = 1 2 Seconds
CR2 = 1, CR1 = 0, CR0 = 0 4 Seconds
Resolution Die temperature sensor 0.03125 °C
Thermopile sensor resolution 156.25 nV
SMBus COMPATIBLE INTERFACE
VIH Logic input high voltage (SCL, SDA) TMP006 only 2.1 V
TMP006B only 1.4 V
VIL Logic input low voltage (SCL, SDA) TMP006 only 0.8 V
TMP006B only 0.4 V
Hysteresis 100 mV
VOL Output low voltage (SDA) IOUT = 6 mA 0.15 0.4 V
Output low sink current (SDA) 6 mA
Logic input current Forced to 0.4 V –1 +1 µA
Input capacitance (SCL, SDA, A0, A1) 3 pF
Clock frequency 0.001 3.4 MHz
Interface timeout 25 30 35 ms
DIGITAL OUTPUTS
VOL Output low voltage (DRDY) IOUT = 4 mA 0.15 0.4 V
IOH High-level output leakage current VOUT = VDD 0.1 1 µA
Output low sink current (DRDY) Forced to 0.4 V 4 mA
POWER SUPPLY
VS Specified voltage range TDIE = –40°C to +125°C 2.2 5.5 V
POR Power-on reset TDIE = –40°C to +125°C 1.6 V
IQ Quiescent current Continuous conversion; see Table 7 240 325 µA
Serial bus inactive, shutdown mode, TMP006 only 0.5 1.0 µA
Serial bus inactive, shutdown mode, TMP006B only 1.5 5.0 µA
Serial bus active, fS = 400 kHz,
shutdown mode		 90 µA
(1) This parameter is tested in a fully-settled setup with no transients, in front of an ideal black body, with specified layout constraints, and after system calibration.

7.6 Typical Characteristics

At TDIE = +25°C and VS = 3.3 V, unless otherwise noted.
TMP006 TMP006B tc_local_err-ta_bos518.gif
Figure 1. Typical Die Temperature Error
TMP006 TMP006B C001_SBOS518.png
Figure 3. Responsivity vs Angle
TMP006 TMP006B tc_object_err-ta_bos518.gif
Figure 2. Typical Object Temperature Error
TMP006 TMP006B tc_histo_bos518.gif
TOBJ = 20°C, TDIE = 20°C,
valid for 120° FOV and object emissivity = 0.94
Figure 4. Noise-Limited, Object-Temperature Accuracy