SBOS581B September   2011  – June 2022 TMP100-Q1 , TMP101-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Digital Temperature Output
      2. 7.3.2  Serial Interface
      3. 7.3.3  Bus Overview
      4. 7.3.4  Serial Bus Address
      5. 7.3.5  Writing and Reading to the TMP100-Q1 and TMP101-Q1
      6. 7.3.6  Target Mode Operations
        1. 7.3.6.1 Target Receiver Mode
        2. 7.3.6.2 Target Transmitter Mode
      7. 7.3.7  SMBus Alert Function
      8. 7.3.8  General Call
      9. 7.3.9  High-Speed Mode
      10. 7.3.10 POR (Power-On Reset)
      11. 7.3.11 Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 OS/ALERT (OS)
      3. 7.4.3 Thermostat Mode (TM)
      4. 7.4.4 Comparator Mode (TM = 0)
      5. 7.4.5 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
        1. 7.5.1.1 Pointer Register Byte (pointer = N/A) [reset = 00h]
        2. 7.5.1.2 Pointer Addresses of the TMP100-Q1 and TMP101-Q1 Registers
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1, F0)
        5. 7.5.3.5 Converter Resolution (R1, R0)
        6. 7.5.3.6 OS/ALERT (OS)
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.