SNIS233 February   2024 TMP110

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Temperature Limits and Alert
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Bus Overview
      3. 7.5.3 Device Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
        3. 7.5.4.3 General Call Reset Function
        4. 7.5.4.4 SMBus Alert Response
        5. 7.5.4.5 Time-Out Function
        6. 7.5.4.6 Coexist on I3C Mixed Bus
  9. 8 Register Map
    1. 8.1 Temp_Result Register (address = 00h) [reset = xxxxh]
    2. 8.2 Configuration Register (address = 01h) [reset = 60A0h]
    3. 8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]
    4. 8.4 THigh_Limit Register (address = 03h) [reset = 5000h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Separate I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
    3. 9.3 Equal I2C Pullup and Supply Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.