SBOS473I March   2009  – December 2018 TMP112

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Slave Mode Operations
          1. 7.3.2.4.1 Slave Receiver Mode
          2. 7.3.2.4.2 Slave Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuos-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 One-Shot/Conversion Ready Mode (OS)
      4. 7.4.4 Thermostat Mode (TM)
        1. 7.4.4.1 Comparator Mode (TM = 0)
        2. 7.4.4.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
      4. 7.5.4 High- and Low-Limit Register
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

Figure 19 shows the step response of the TMP112 family to a submersion in an oil bath of 100ºC from room temperature (27ºC). The time-constant, or the time for the output to reach 63% of the input step, is 0.8 s. The time-constant result depends on the printed-circuit board (PCB) that the TMP112 family is mounted. For this test, the TMP112 family was soldered to a two-layer PCB that measured 0.375 inches × 0.437 inches.

TMP112 AppGraph_SLOS887_TMP112-Q1.gifFigure 19. Temperature Step Response