SNIS216A November   2019  – February 2026 TMP392

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 TMP392 Programming Tables
      2. 6.3.2 Trip Test
      3. 6.3.3 20°C Hysteresis
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Applications Information
    2. 7.2 Typical Applications
      1. 7.2.1 Simplified Application Schematic
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 TMP392 With 10°C Hysteresis
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
      3. 7.2.3 One Channel Operation for Hot Trip Point up to 124°C
        1. 7.2.3.1 Application Curve
      4. 7.2.4 One Channel Operation for Warm Trip Point from 30°C up to 105°C
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from November 30, 2019 to February 25, 2026 (from Revision * (November 2019) to Revision A (February 2026))

  • Added the Related Documentation and Documentation Support sectionsGo