SBOS762B November   2016  – June 2017 TMP468

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Sensor Fault
      5. 7.3.5 THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
          1. 7.5.1.4.1 Single Register Reads
          2. 7.5.1.4.2 Block Register Reads
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 TMP468 Register Reset
      3. 7.5.3 Lock Register
    6. 7.6 Register Maps
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Value Registers
        3. 7.6.1.3  Software Reset Register
        4. 7.6.1.4  THERM Status Register
        5. 7.6.1.5  THERM2 Status Register
        6. 7.6.1.6  Remote Channel Open Status Register
        7. 7.6.1.7  Configuration Register
        8. 7.6.1.8  η-Factor Correction Register
        9. 7.6.1.9  Remote Temperature Offset Register
        10. 7.6.1.10 THERM Hysteresis Register
        11. 7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 7.6.1.12 Block Read - Auto Increment Pointer
        13. 7.6.1.13 Lock Register
        14. 7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TMP468 YFF Package
16-Pin DSBGA
Bottom View
TMP468 PinOut_01_YFF_SBOS762.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ADD B4 Digital input Address select. Connect to GND, V+, SDA, or SCL.
D1+ A1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D2+ B1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D3+ C1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D4+ D1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D5+ A2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D6+ B2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D7+ C2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D8+ D2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D– A3 Analog input Negative connection to remote temperature sensors. Common for 8 remote channels.
GND A4 Ground Supply ground connection
SCL D4 Digital input Serial clock line for I2C- or SMBus compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven by an open-drain output.
SDA C4 Bidirectional digital input/output Serial data line for I2C or SMBus compatible two-wire interface. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.
THERM B3 Digital output Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
THERM2 C3 Digital output Second THERM output.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
V+ D3 Power supply Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.
TMP468 RGT Package
16-Pin VQFN
Top View
TMP468 TMP468_RTE_pinout.gif
NC - No internal connection

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ADD 9 Digital input Address select. Connect to GND, V+, SDA, or SCL.
D1+ 6 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D2+ 5 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D3+ 4 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D4+ 3 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D5+ 2 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D6+ 1 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D7+ 16 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D8+ 15 Analog input Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An unused channel must be connected to D–.
D– 7 Analog input Negative connection to remote temperature sensors. Common for 8 remote channels.
GND 8 Ground Supply ground connection
SCL 13 Digital input Serial clock line for I2C or SMBus-compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven by an open-drain output.
SDA 12 Bidirectional digital input/output Serial data line for I2C- or SMBus-compatible two-wire interface. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.
THERM 10 Digital output Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
THERM2 11 Digital output Second THERM output.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+. If this pin is not used it may be left open or grounded.
V+ 14 Power supply Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.