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The current documentation that describes the processor, related peripherals, and other technical collateral is listed here.
TMS320F2805x MCUs Silicon Errata describes known advisories on silicon and provides workarounds.
InstaSPIN Technical Reference Manuals
InstaSPIN-FOC™ and InstaSPIN-MOTION™ User's Guide describes the InstaSPIN-FOC and InstaSPIN-MOTION devices.
TMS320F28054F, TMS320F28052F InstaSPIN-FOC™ Software Technical Reference Manual describes TMS320F28054F and TMS320F28052F InstaSPIN-FOC software.
TMS320F28054M, TMS320F28052M InstaSPIN-MOTION™ Software Technical Reference Manual describes TMS320F28054M and TMS320F28052M InstaSPIN-MOTION software.
CPU User's Guides
TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). This reference guide also describes emulation features available on these DSPs.
Peripheral Guides and Technical Reference Manuals
C2000 Real-Time Control Peripherals Reference Guide describes the peripheral reference guides of the 28x digital signal processors (DSPs).
TMS320x2805x Technical Reference Manual details the integration, the environment, the functional description, and the programming models for each peripheral and subsystem in the 2805x microcontrollers.
TMS320C28x Assembly Language Tools v20.2.0.LTS User's Guide describes the assembly language tools (assembler and other tools used to develop assembly language code), assembler directives, macros, common object file format, and symbolic debugging directives for the TMS320C28x device.
TMS320C28x Optimizing C/C++ Compiler v20.2.0.LTS User's Guide describes the TMS320C28x C/C++ compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly language source code for the TMS320C28x device.
Semiconductor Packing Methodology describes the packing methodologies employed to prepare semiconductor devices for shipment to end users.
Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful lifetime of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at general engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement.
Semiconductor and IC Package Thermal Metrics describes traditional and new thermal metrics and puts their application in perspective with respect to system-level junction temperature estimation.
MCU CAN Module Operation Using the On-Chip Zero-Pin Oscillator.
The TMS320F2803x/TMS320F2805x/TMS320F2806x series of microcontrollers have an on-chip zero-pin oscillator that needs no external components. This application report describes how to use the CAN module with this oscillator to operate at the maximum bit rate and bus length without the added cost of an external clock source.
An Introduction to IBIS (I/O Buffer Information Specification) Modeling discusses various aspects of IBIS including its history, advantages, compatibility, model generation flow, data requirements in modeling the input/output structures and future trends.
Serial Flash Programming of C2000™ Microcontrollers discusses using a flash kernel and ROM loaders for serial programming a device.