SCDS463A June   2022  – March 2023 TMUX4051-Q1 , TMUX4052-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information: TMUX4051-Q1
    4. 7.4 Thermal Information: TMUX4052-Q1
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 AC Performance Characteristics
    8. 7.8 Timing Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Propagation Delay
    8. 8.8  Charge Injection
    9. 8.9  Off Isolation
    10. 8.10 Crosstalk
    11. 8.11 Bandwidth
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Device Functional Modes
      5. 9.3.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curves
    6. 10.6 Power Supply Recommendations
    7. 10.7 Layout
      1. 10.7.1 Layout Guidelines
      2. 10.7.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
  • DYY|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Thermal Information: TMUX4051-Q1

THERMAL METRIC (1) TMUX4051-Q1 UNIT
PW (TSSOP) DYY (SOT) BQB (WQFN)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance  116.5 138.9 70.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.2 70.3 67.8 °C/W
RθJB Junction-to-board thermal resistance 63.0 69.1 40.2 °C/W
ΨJT Junction-to-top characterization parameter 6.4 5.1 3.9 °C/W
ΨJB Junction-to-board characterization parameter 62.1 69.0 40.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A 18.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.