SLVSLR3A August   2026  – October 2026 TMUX5508 , TMUX5509

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (±15V Dual Supply)
    6. 6.6  Switching Characteristics (±15V Dual Supply)
    7. 6.7  Electrical Characteristics (±20V Dual Supply)
    8. 6.8  Switching Characteristics (±20V Dual Supply)
    9. 6.9  Electrical Characteristics (12V Single Supply)
    10. 6.10 Switching Characteristics (12V Single Supply)
    11. 6.11 Electrical Characteristics (40V Single Supply)
    12. 6.12 Switching Characteristics (40V Single Supply)
    13. 6.13 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  Break-Before-Make Delay
    6. 7.6  Turn-On and Turn-Off Time
    7. 7.7  Charge Injection
    8. 7.8  Off Isolation
    9. 7.9  Channel-to-Channel Crosstalk
    10. 7.10 Bandwidth
    11. 7.11 THD + Noise
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8V Logic Compatible Inputs
      4. 8.3.4 Flat On-Resistance
      5. 8.3.5 Power-Up Sequence Free
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Gain Switching
      1. 9.2.1 Design Requirements
      2. 9.2.2 Application Curve
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.13 Typical Characteristics

at TA = 25°C (unless otherwise noted)

TMUX5508 TMUX5509 On-Resistance vs Source or Drain Voltage for Dual Supply
TA = 25°
Figure 6-1 On-Resistance vs Source or Drain Voltage for Dual Supply
TMUX5508 TMUX5509 On-Resistance vs Source or Drain Operational Voltage (Flat Region)
VDD=15V, VSS=-15V
Figure 6-3 On-Resistance vs Source or Drain Operational Voltage (Flat Region)
TMUX5508 TMUX5509 Leakage Current vs Bias Voltage
VDD = 15V, VSS = -15V; TA = 25°
Figure 6-5 Leakage Current vs Bias Voltage
TMUX5508 TMUX5509 ±15V Bandwidth vs. Frequency
VDD = 15V, VSS = -15V
Figure 6-7 ±15V Bandwidth vs. Frequency
TMUX5508 TMUX5509 On-Resistance vs Source or Drain Voltage for Single Supply
TA = 25°
Figure 6-2 On-Resistance vs Source or Drain Voltage for Single Supply
TMUX5508 TMUX5509 On-Resistance vs Source or Drain Voltage
VDD = 15V, VSS = -15V
Figure 6-4 On-Resistance vs Source or Drain Voltage
TMUX5508 TMUX5509 Charge Injection vs Source Voltage
VDD = 15V, VSS = -15V
Figure 6-6 Charge Injection vs Source Voltage