SCDS434 October   2021 TMUX8212

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX821x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions: TMUX821x Devices
    5. 6.5  Electrical Characteristics (Global): TMUX821x Devices
    6. 6.6  Electrical Characteristics (±36-V Dual Supply)
    7. 6.7  Electrical Characteristics (72-V Single Supply)
    8. 6.8  Electrical Characteristics (100-V Single Supply)
    9. 6.9  Switching Characteristics: TMUX821x Devices
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Truth Tables
    2. 7.2 On-Resistance
    3. 7.3 Off-Leakage Current
    4. 7.4 On-Leakage Current
    5. 7.5 Device Turn On Time
    6. 7.6 Charge Injection
    7. 7.7 Off Isolation
    8. 7.8 Crosstalk
    9. 7.9 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat On - Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Fail-Safe Logic
        2. 8.3.2.2 ESD Protection
        3. 8.3.2.3 Latch-Up Immunity
      3. 8.3.3 Bidirectional and Rail-to-Rail Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

Figure 5-1 PW Package
16-Pin TSSOP
Top View
Figure 5-2 RUM Package (Preview)
16-Pin WQFN
Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME TSSOP WQFN(2)
S1 1 15 I/O Source pin 1. Can be an input or an output.
D1 2 16 I/O Drain pin 1. Can be an input or an output.
SEL1 3 2 I Logic control input 1.
VSS 4 1 P Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 1 µF to 10 µF between VSS and GND.
GND 5 3 P Ground (0 V) reference
SEL4 6 4 I Logic control input 4.
D4 7 5 I/O Drain pin 4. Can be an input or an output.
S4 8 6 I/O Source pin 4. Can be an input or an output.
S3 9 7 I/O Source pin 3. Can be an input or an output.
D3 10 8 I/O Drain pin 3. Can be an input or an output.
SEL3 11 11 I Logic control input 2.
N.C. 12 10 No internal connection.
VDD 13 9 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 1 µF to 10 µF between VDD and GND.
SEL2 14 12 I Logic control input 2.
D2 15 13 I/O Drain pin 2. Can be an input or an output.
S2 16 14 I/O Source pin 2. Can be an input or an output.
Thermal Pad The thermal pad is not connected internally. No requirement to solder this pad, if connected it is recommended that the pad be tied to GND.
I = input, O = output, I/O = input and output, P = power
Preview package.