SCDS434 October   2021 TMUX8212

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX821x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions: TMUX821x Devices
    5. 6.5  Electrical Characteristics (Global): TMUX821x Devices
    6. 6.6  Electrical Characteristics (±36-V Dual Supply)
    7. 6.7  Electrical Characteristics (72-V Single Supply)
    8. 6.8  Electrical Characteristics (100-V Single Supply)
    9. 6.9  Switching Characteristics: TMUX821x Devices
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Truth Tables
    2. 7.2 On-Resistance
    3. 7.3 Off-Leakage Current
    4. 7.4 On-Leakage Current
    5. 7.5 Device Turn On Time
    6. 7.6 Charge Injection
    7. 7.7 Off Isolation
    8. 7.8 Crosstalk
    9. 7.9 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat On - Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Fail-Safe Logic
        2. 8.3.2.2 ESD Protection
        3. 8.3.2.3 Latch-Up Immunity
      3. 8.3.3 Bidirectional and Rail-to-Rail Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings: TMUX821x Devices

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)
MIN MAX UNIT
VDD–VSS Supply voltage 110 V
VDD –0.5 110 V
VSS –110 0.5 V
VSELx Logic control input pin voltage (SELx) –0.5 50 V
ISELx Logic control input pin current (SELx) –30 30 mA
VS or VD Source or drain voltage (Sx, Dx) VSS–2 VDD+2 V
IS or ID (CONT) Source or drain continuous current (Sx, Dx) –100 100 mA
Tstg Storage temperature –65 150 °C
TJ Junction temperature 150 °C
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
All voltages are with respect to ground, unless otherwise specified.