SCDS453E June   2024  – October 2025 TMUXS7614D

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Source or Drain Current through Switch
    6. 5.6  Electrical Characteristics (Global)
    7. 5.7  Electrical Characteristics (±15V Dual Supply)
    8. 5.8  Switching Characteristics (±15V Dual Supply)
    9. 5.9  Electrical Characteristics (±20V Dual Supply)
    10. 5.10 Switching Characteristics (±20V Dual Supply)
    11. 5.11 Electrical Characteristics (+37.5V/–12.5V Dual Supply)
    12. 5.12 Switching Characteristics (+37.5V/–12.5V Dual Supply)
    13. 5.13 Electrical Characteristics (12V Single Supply)
    14. 5.14 Switching Characteristics (12V Single Supply)
    15. 5.15 SPI Timing Characteristics (2.7V to 5.5V)
    16. 5.16 SPI Timing Characteristics (1.8V to 2.7V)
    17. 5.17 Timing Diagrams
    18. 5.18 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  tON and tOFF Time
    5. 6.5  Break-Before-Make
    6. 6.6  Charge Injection
    7. 6.7  Off Isolation
    8. 6.8  Channel-to-Channel Crosstalk
    9. 6.9  Bandwidth
    10. 6.10 THD + Noise
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail-to-Rail Operation
      3. 7.3.3 1.8V Logic Compatible Inputs
      4. 7.3.4 Flat On-Resistance
      5. 7.3.5 Power-Up Sequence Free
    4. 7.4 SPI Operation
      1. 7.4.1 Address Mode
      2. 7.4.2 Burst Mode
      3. 7.4.3 Daisy Chain Mode
      4. 7.4.4 Error Detection
        1. 7.4.4.1 Address R/W Error Flag
        2. 7.4.4.2 SCLK Count Error Flag
        3. 7.4.4.3 CRC (Cyclic Redundancy Check) Enable and Error Flag
        4. 7.4.4.4 Clearing Error Flags
      5. 7.4.5 Software Reset
    5. 7.5 Device Functional Modes
    6. 7.6 Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Recommended Reflow Profile
    4. 8.4 Thermal Considerations
    5. 8.5 Power Supply Recommendations
    6. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZEM|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Off Isolation

Off isolation is defined as the ratio of the signal at the drain pin (Dx) of the device when a signal is applied to the source pin (Sx) of an off-channel. The characteristic impedance, Z0, for the measurement is 50Ω. Figure 6-7 shows the setup used to measure off isolation. Use off isolation equation to compute off isolation.

TMUXS7614D Off Isolation Measurement Setup TMUXS7614D Off Isolation Measurement Setup Figure 6-7 Off Isolation Measurement Setup