SLOS794B September   2012  – September 2015 TPA3110D2-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Characteristics
    6. 6.6 DC Characteristics
    7. 6.7 AC Characteristics
    8. 6.8 AC Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DC Detect
      2. 7.3.2 Short-Circuit Protection and Automatic Recovery Feature
      3. 7.3.3 Thermal Protection
      4. 7.3.4 GVDD Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 PBTL Select
      2. 7.4.2 Gain Setting Through GAIN0 and GAIN1 Inputs
      3. 7.4.3 SD Operation
      4. 7.4.4 PLIMIT
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 TPA3110D2-Q1 Modulation Scheme
        2. 8.2.2.2 Ferrite Bead Filter Considerations
        3. 8.2.2.3 Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
        4. 8.2.2.4 When to Use an Output Filter for EMI Suppression
        5. 8.2.2.5 Input Resistance
        6. 8.2.2.6 Input Capacitor, CI
        7. 8.2.2.7 BSN and BSP Capacitors
        8. 8.2.2.8 Differential Inputs
        9. 8.2.2.9 Using Low-ESR Capacitors
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.