SLDS182A August   2010  – July 2015 TPIC7218-Q1

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Pin Configuration and Functions
  4. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Input Port Electrical Characteristics
    6. 4.6  PWM Low-Side Driver Electrical Characteristics
    7. 4.7  Digital Low-Side Driver Electrical Characteristics
    8. 4.8  High-Side Driver Electrical Characteristics
    9. 4.9  K-Line Electrical Characteristics
    10. 4.10 Warning Lamp Electrical Characteristics
    11. 4.11 Power Supply Electrical Characteristics
    12. 4.12 SPI Electrical Characteristics
    13. 4.13 WL_LS Low-Side Switch Output Characteristics
    14. 4.14 Wheel-Speed High-Side Driver Characteristics
    15. 4.15 Wheel-Speed Low-Side Driver Characteristics
    16. 4.16 Wheel-Speed Output Characteristics
    17. 4.17 RST Output Characteristics
    18. 4.18 SPI Timing Electrical Characteristics
    19. 4.19 Power Supply Switching Characteristics
    20. 4.20 Wheel-Speed Counter Switching Characteristics
    21. 4.21 HS Driver Switching Characteristics
    22. 4.22 Digital Low-Side Driver Switching Characteristics
    23. 4.23 PWM Low-Side Driver Switching Characteristics
    24. 4.24 K-Line Switching Characteristics
    25. 4.25 Warning Lamp Switching Characteristics
    26. 4.26 Watchdog Switching Characteristics
    27. 4.27 Wheel Speed Interface Switching Characteristics
    28. 4.28 Wheel-Speed High-Side Driver Switching Characteristics
    29. 4.29 Wheel-Speed Output Switching Characteristics
    30. 4.30 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1  Ground Connections
      2. 5.3.2  Charge Pump
      3. 5.3.3  Reference Current Generator
      4. 5.3.4  Wheel-Speed Reference, VREF
      5. 5.3.5  Faults Common To Most Functional Blocks
      6. 5.3.6  PWM Low-Side Drivers
      7. 5.3.7  Digital Low-Side Drivers
      8. 5.3.8  High-Side Drivers
        1. 5.3.8.1 High-Side Terminals: GPR, SPR, DPR, and HSPC
        2. 5.3.8.2 High-Side Terminals: GMR, SMR, DMR, and HSMC
      9. 5.3.9  Wheel-Speed Sensing
      10. 5.3.10 K-Line
      11. 5.3.11 Warning Lamp Drivers
      12. 5.3.12 Watchdog Operation
    4. 5.4 Device Functional Modes
      1. 5.4.1 Device Reset
    5. 5.5 Programming
      1. 5.5.1 Serial Peripheral Interface (SPI) Interface To Microcontroller
        1. 5.5.1.1 Summary and Description Of Control and Reporting Registers
    6. 5.6 Register Maps
      1. 5.6.1 SPI Registers
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 Gatedrive circuit Motor FET
        2. 6.2.2.2 Gatedrive circuit Master Relay FET
      3. 6.2.3 Application Curves
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Local Grounding Configuration
      2. 8.1.2 Board Level Grounding Configuration, TPIC7218-Q1 to System Connector
      3. 8.1.3 VCC3 Bypass Capacitor
      4. 8.1.4 VDD Bypass Capacitor
      5. 8.1.5 VBAT and CHP Capacitors
      6. 8.1.6 Multiple Plane Layer Assignments
      7. 8.1.7 Duplicate Pad Under TPIC7218-Q1 on All Non-Ground Plane Inner Layers
      8. 8.1.8 Flooding
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Community Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation see the following: TPIC7218-Q1 Thermal Design Considerations and Solution, SLDA013

9.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

9.3 Trademarks

E2E is a trademark of Texas Instruments.

PowerPAD is a trademark of TI.

All other trademarks are the property of their respective owners.

9.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

9.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.