SLVS490J december   2003  – august 2023 TPS2061 , TPS2062 , TPS2063 , TPS2065 , TPS2066 , TPS2067

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Dissipating Rating Table
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Typical Characteristics(All Devices Excluding TPS2065DBV)
    6. 7.6 Typical Characteristics (TPS2065DBV)
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1  Functional Block Diagram
    2. 9.2  Power Switch
    3. 9.3  Charge Pump
    4. 9.4  Driver
    5. 9.5  Enable ( ENx or ENx)
    6. 9.6  Current Sense
    7. 9.7  Overcurrent
      1. 9.7.1 Overcurrent Conditions (All Devices Excluding TPS2065DBV)
      2. 9.7.2 Overcurrent Conditions (TPS2065DBV)
    8. 9.8  Overcurrent ( OCx)
    9. 9.9  Thermal Sense
    10. 9.10 Undervoltage Lockout
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1  Power-supply Considerations
      2. 10.1.2  OC Response
      3. 10.1.3  Power Dissipation and Junction Temperature
      4. 10.1.4  Thermal Protection
      5. 10.1.5  Undervoltage Lockout (UVLO)
      6. 10.1.6  Universal Serial Bus (USB) Applications
      7. 10.1.7  Host/Self-Powered and Bus-powered Hubs
      8. 10.1.8  Low-power Bus-powered and High-Power Bus-Powered Functions
      9. 10.1.9  USB Power-distribution Requirements
      10. 10.1.10 Generic Hot-Plug Applications
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|5
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 Dissipating Rating Table

PACKAGE TA ≤ 25°C
POWER RATING		 DERATING FACTOR
ABOVE TA = 25°C		 TA = 70°C
POWER RATING		 TA = 85°C
POWER RATING
D-8(3) 585.82 mW 5.8582 mW/°C 322.20 mW 234.32 mW
DGN-8(2) 1712.3 mW 17.123 mW/°C 941.78 mW 684.33 mW
D-16(3) 898.47 mW 8.9847 mW/°C 494.15 mW 359.38 mW
DBV-5(1) 285 mW 2.85 mW/°C 155 mW 114 mW
704 mW 7.04 mW/°C 387 mW 281 mW
(1) Lower ratings are for low-k printed circuit board layout (single -sided). Higher ratings are for enhanced high-k layout, (2 signal, 2 plane) with a 1mm2 copper pad on pin 2 and 2 vias to the ground plane.
(2) Power ratings are based on the high-k board (2 signal, 2 plane) with PowerPAD™ vias to the internal ground plane.
(3) Power ratings are based on the low-k board (1 signal, 1 layer).