SLVSBL3D November   2012  – July 2021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
      1. 5.7.1 Typical AC Scope Captures at TA = 25°C
  6. 6 Pin Configuration and Functions
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On And Off Control
      2. 8.3.2 UVLO
      3. 8.3.3 Reverse Current Protection
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (Optional)
      2. 9.1.2 Output Capacitor (Optional)
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YZV|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.3 Thermal Considerations

The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use the following equation as a guideline:

Equation 1. GUID-C346BA6B-E78A-4122-8220-B50C032AB225-low.gif

where

  • PD(max) = maximum allowable power dissipation
  • TJ(max) = maximum allowable junction temperature (125°C for the TPS22930)
  • TA = ambient temperature of the device
  • ΘJA = junction to air thermal impedance. See Thermal Information table. This parameter is highly dependent upon board layout.

The power dissipated by the device depends on the RON of the device at a given VIN. To calculate the amount of power being dissipated by the device, use the following equation:

Equation 2. GUID-A483F2C5-D150-4B3F-9079-8A6A5D23EEC4-low.gif

where

  • PIR = power dissipated by the device
  • I = load current in amperes
  • RON = resistance of the device in Ohms at a given VIN (see Electrical Characteristics table)

The result from Equation 2 should always be less than or equal to the result from Equation 1.