SLVSGG6B april   2022  – june 2023 TPS25981

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
      1.      16
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 8.3.2 Overvoltage Lockout (OVLO)
      3. 8.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 8.3.3.2 Circuit-Breaker During Steady-State
        3. 8.3.3.3 Active Current Limiting During Start-Up
        4. 8.3.3.4 Short-Circuit Protection
      4. 8.3.4 Analog Load Current Monitor
      5. 8.3.5 Overtemperature Protection (OTP)
      6. 8.3.6 Fault Response and Indication (FLT)
      7. 8.3.7 Power Good Indication (PG)
      8. 8.3.8 Quick Output Discharge (QOD)
      9. 8.3.9 Reverse Current Blocking FET Driver
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Self-Controlled
      2. 9.1.2 Parallel Operation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Selection
        2. 9.2.2.2 Setting Output Voltage Rise Time (tR)
        3. 9.2.2.3 Setting Overcurrent Threshold (ILIM)
        4. 9.2.2.4 Setting Overcurrent Blanking Interval (tITIMER)
        5. 9.2.2.5 Voltage Drop
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Switching Characteristics

The output rising slew rate is internally controlled and constant across the entire operating voltage range to ensure the turn on timing is not affected by the load conditions. The rising slew rate can be adjusted by adding capacitance from the dVdt pin to ground. As CdVdt is increased it slows the rising slew rate (SR). See Slew Rate and Inrush Current Control (dVdt) section for more details. The Turn-Off Delay and Fall Time, however, are dependent on the RC time constant of the load capacitance (COUT) and Load Resistance (RL). The Switching Characteristics are only valid for the power-up sequence where the supply is available in steady-state condition and the load voltage is completely discharged before the device is enabled. Typical values are taken at TJ = 25°C unless specifically noted otherwise. RL = 100 Ω, COUT = 1 µF. 
PARAMETER VIN
 CdVdt = Open CdVdt = 1800 pF CdVdt = 3300 pF UNITS
SRON Output rising slew rate 2.7 V 8.19 1.30 0.78 V/ms
5 V 11.28 1.42 0.84
12 V 19.71 1.68 0.98
tD,ON Turn-on delay 2.7 V 0.14 0.46 0.70 ms
5 V 0.14 0.60 0.96
12 V 0.14 0.93 1.57
tR Rise time 2.7 V 0.26 1.66 2.77 ms
5 V 0.36 2.82 4.78
12 V 0.49 5.74 9.84
tON Turn-on time 2.7 V 0.40 2.11 3.47 ms
5 V 0.50 3.42 5.74
12 V 0.63 6.67 11.41
tD,OFF Turn-off delay 2.7 V 24.90 24.90 24.90 µs
5 V 21.10 21.10 21.10
12 V 18.80 18.80 18.80