SBVS211B August   2012  – April 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Push-Button Timer Selection (TS)
      2. 7.3.2 Inputs
        1. 7.3.2.1 TPS3420 Inputs (PB1, PB2)
        2. 7.3.2.2 TPS3421 Inputs (PB1, PB2)
        3. 7.3.2.3 TPS3422 Inputs (PB1)
      3. 7.3.3 Output (RST)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > 1.6 V)
      2. 7.4.2 Below VDD(min) (1.6 V > VDD > 1.3 V)
      3. 7.4.3 Power-On Reset (VDD < 1.3 V)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Single Input With Fixed Reset Pulse Duration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Dual Input Applications
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Latched Reset Signal
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

Follow these guidelines for laying out the printed circuit board (PCB) that is used for the TPS342x.

  • Place the VCC decoupling capacitor close to the device.
  • Avoid using long traces for the VCC supply node. The VDD capacitor (CVDD), along with parasitic inductance from the supply to the capacitor, can form an LC tank and create ringing with peak voltages above the maximum VCC voltage.

10.2 Layout Example

TPS342 LayoutDRY_sbvs211.gifFigure 21. Layout Example (DRY Package)