SNVSCE6A October   2023  – May 2024 TPS3762-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Nomenclature
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Requirements
    7. 7.7 Timing Requirements
  9. 8 Timing Diagrams
  10. 9 Typical Characteristics
  11. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Input Voltage (VDD)
        1. 10.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 10.3.1.2 Power-On Reset (VDD < VPOR )
      2. 10.3.2 SENSE
        1. 10.3.2.1 Reverse Polarity Protection
        2. 10.3.2.2 SENSE Hysteresis
      3. 10.3.3 Output Logic Configurations
        1. 10.3.3.1 Open-Drain
        2. 10.3.3.2 Active-Low (RESET)
        3. 10.3.3.3 Latching
        4. 10.3.3.4 UVBypass
      4. 10.3.4 User-Programmable Reset Time Delay
        1. 10.3.4.1 Reset Time Delay Configuration
      5. 10.3.5 User-Programmable Sense Delay
        1. 10.3.5.1 Sense Time Delay Configuration
      6. 10.3.6 Built-In Self-Test
    4. 10.4 Device Functional Modes
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Adjustable Voltage Thresholds
    3. 11.3 Typical Application
      1. 11.3.1 Design 1: Off-Battery Monitoring
        1. 11.3.1.1 Design Requirements
        2. 11.3.1.2 Detailed Design Procedure
          1. 11.3.1.2.1 Setting Voltage Threshold
          2. 11.3.1.2.2 Meeting the Sense and Reset Delay
          3. 11.3.1.2.3 Setting Supply Voltage
          4. 11.3.1.2.4 Initiating Built-In Self-Test and Clearing Latch
        3. 11.3.1.3 Application Curves
    4. 11.4 Power Supply Recommendations
      1. 11.4.1 Power Dissipation and Device Operation
    5. 11.5 Layout
      1. 11.5.1 Layout Guidelines
      2. 11.5.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) TPS3762-Q1 UNIT
DDF
8-PIN
RθJA Junction-to-ambient thermal resistance 154.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 77.4 °C/W
RθJB Junction-to-board thermal resistance 73.2 °C/W
ψJT Junction-to-top characterization parameter 4.8 °C/W
ψJB Junction-to-board characterization parameter 72.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.