An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS3779 and TPS3780. SLVU796 details the design kits and evaluation modules for TPS3780EVM-154.
Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS3779 and TPS3780 is available through the respective device product folders under Simulation Models.
The TPS3779xyyyz and TPS3780xyyyz are the generic naming conventions for these devices. The TPS3779 and TPS3780 represent the family of these devices; x is used to display the hysteresis version, yyy is reserved for the package designator, and z is the package quantity.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.