SLUSAQ4G October   2011  – September 2022 TPS40422

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  PMBus Interface Protocol General Description
      2. 8.3.2  Voltage Reference
      3. 8.3.3  Output Voltage
      4. 8.3.4  Voltage Feed Forward
      5. 8.3.5  Current Sensing
      6. 8.3.6  Overcurrent Protection
      7. 8.3.7  Current Sharing
      8. 8.3.8  Linear Regulators
      9. 8.3.9  BP Switch-over
      10. 8.3.10 Switching Frequency Setting
      11. 8.3.11 Switching Node and BOOT Voltage
      12. 8.3.12 Reading the Output Current
      13. 8.3.13 Soft-Start Time
      14. 8.3.14 Turn-On/Turn-Off Delay and Sequencing
      15. 8.3.15 Pre-Biased Output Start-Up
      16. 8.3.16 Undervoltage Lockout
      17. 8.3.17 Overvoltage and Undervoltage Fault Protection
      18. 8.3.18 Power Good
      19. 8.3.19 Overtemperature Fault Protection
      20. 8.3.20 Thermal Shutdown
      21. 8.3.21 Programmable Fault Responses
      22. 8.3.22 User Data
      23. 8.3.23 Adjustable Anti-Cross Conduction Delay
      24. 8.3.24 Connection of Unused Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Signal
      2. 8.4.2 OPERATION Command
      3. 8.4.3 Control Signal and OPERATION Command
      4. 8.4.4 Two-Phase Mode Operation
    5. 8.5 Programming
      1. 8.5.1 Supported PMBus Commands
        1. 8.5.1.1 PMBus Address
        2. 8.5.1.2 PMBus Connections
        3. 8.5.1.3 PMBus Data Format
        4. 8.5.1.4 PMBus Interface Output Voltage Adjustment
        5. 8.5.1.5 53
    6. 8.6 Register Maps
      1. 8.6.1 Supported Commands
        1. 8.6.1.1  PAGE (00h)
        2. 8.6.1.2  OPERATION (01h)
          1. 8.6.1.2.1 On
          2. 8.6.1.2.2 Margin
        3. 8.6.1.3  ON_OFF_CONFIG (02h)
          1. 8.6.1.3.1 pu
          2. 8.6.1.3.2 cmd
          3. 8.6.1.3.3 CPR
          4. 8.6.1.3.4 pol
          5. 8.6.1.3.5 CPA
        4. 8.6.1.4  CLEAR_FAULTS (03h)
        5. 8.6.1.5  WRITE_PROTECT (10h)
          1. 8.6.1.5.1 bit5
          2. 8.6.1.5.2 bit6
          3. 8.6.1.5.3 bit7
        6. 8.6.1.6  STORE_USER_ALL (15h)
        7. 8.6.1.7  RESTORE_USER_ALL (16h)
        8. 8.6.1.8  CAPABILITY (19h)
        9. 8.6.1.9  VOUT_MODE (20h)
          1. 8.6.1.9.1 Mode:
          2. 8.6.1.9.2 Exponent
        10. 8.6.1.10 VIN_ON (35h)
          1. 8.6.1.10.1 Exponent
          2. 8.6.1.10.2 Mantissa
        11. 8.6.1.11 VIN_OFF (36h)
          1. 8.6.1.11.1 Exponent
          2. 8.6.1.11.2 Mantissa
        12. 8.6.1.12 IOUT_CAL_GAIN (38h)
          1. 8.6.1.12.1 Exponent
          2. 8.6.1.12.2 Mantissa
        13. 8.6.1.13 IOUT_CAL_OFFSET (39h)
          1. 8.6.1.13.1 Exponent
          2. 8.6.1.13.2 Mantissa
        14. 8.6.1.14 IOUT_OC_FAULT_LIMIT (46h)
          1. 8.6.1.14.1 Exponent
          2. 8.6.1.14.2 Mantissa
        15. 8.6.1.15 IOUT_OC_FAULT_RESPONSE (47h)
          1. 8.6.1.15.1 RS[2:0]
        16. 8.6.1.16 IOUT_OC_WARN_LIMIT (4Ah)
          1. 8.6.1.16.1 Exponent
          2. 8.6.1.16.2 Mantissa
        17. 8.6.1.17 OT_FAULT_LIMIT (4Fh)
          1. 8.6.1.17.1 Exponent
          2. 8.6.1.17.2 Mantissa
        18. 8.6.1.18 OT_WARN_LIMIT (51h)
          1. 8.6.1.18.1 Exponent
          2. 8.6.1.18.2 Mantissa
        19. 8.6.1.19 TON_RISE (61h)
          1. 8.6.1.19.1 Exponent
          2. 8.6.1.19.2 Mantissa
        20. 8.6.1.20 STATUS_BYTE (78h)
        21. 8.6.1.21 STATUS_WORD (79h)
        22. 8.6.1.22 STATUS_VOUT (7Ah)
        23. 8.6.1.23 STATUS_IOUT (7Bh)
        24. 8.6.1.24 STATUS_TEMPERATURE (7Dh)
        25. 8.6.1.25 STATUS_CML (7Eh)
        26. 8.6.1.26 STATUS_MFR_SPECIFIC (80h)
        27. 8.6.1.27 READ_VOUT (8Bh)
        28. 8.6.1.28 READ_IOUT (8Ch)
          1. 8.6.1.28.1 Exponent
          2. 8.6.1.28.2 Mantissa
        29. 8.6.1.29 READ_TEMPERATURE_2 (8Eh)
          1. 8.6.1.29.1 Exponent
          2. 8.6.1.29.2 Mantissa
        30. 8.6.1.30 PMBUS_REVISION (98h)
        31. 8.6.1.31 MFR_SPECIFIC_00 (D0h)
        32. 8.6.1.32 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
        33. 8.6.1.33 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
        34. 8.6.1.34 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
        35. 8.6.1.35 PCT_VOUT_FAULT_PG_LIMIT (MFR_SPECIFIC_07) (D7h)
        36. 8.6.1.36 126
        37. 8.6.1.37 SEQUENCE_TON_TOFF_DELAY (MFR_SPECIFIC_08) (D8h)
        38. 8.6.1.38 128
        39. 8.6.1.39 OPTIONS (MFR_SPECIFIC_21) (E5h)
        40. 8.6.1.40 DEVICE_CODE (MFR_SPECIFIC_44) (FCh)
          1. 8.6.1.40.1 Identifier Code
          2. 8.6.1.40.2 Revision Code
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Dual-Output Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 9.2.1.2.2 Step 1: Inductor Selection
          3. 9.2.1.2.3 Step 2: Output Capacitor Selection
          4. 9.2.1.2.4 Step 3: Input Capacitance Selection
          5. 9.2.1.2.5 Step 4: MOSFET Selection
          6. 9.2.1.2.6 Step 5: Snubber Circuit Design
          7. 9.2.1.2.7 Step 6: Soft-Start Time
          8. 9.2.1.2.8 Step 7: Peripheral Component Design
            1. 9.2.1.2.8.1 RT (Pin 1) Switching Frequency Setting
            2. 9.2.1.2.8.2 FB1 (Pin 2) and FB2 (Pin 8) Output Voltage Setting
            3. 9.2.1.2.8.3 Compensation Network Using COMP1 (Pin 3) , COMP2 (Pin 7), FB1 (Pin 2) FB2 DIFFO1 (Pin 8) (Pin 39)
            4. 9.2.1.2.8.4 Remote Sensing Using VSNS1 (Pin 37), GSNS1 (Pin 38) , VSNS2 (Pin 15), and GSNS2 (Pin 14)
            5. 9.2.1.2.8.5 Temperate Sensing Using TSNS1 (Pin36) and TSNS2 (Pin 16)
            6. 9.2.1.2.8.6 Current Sensing Network Design Using CS1P (Pin 34), CS1N (Pin 35) , CS2P (Pin 18), and CS2N (Pin 17)
            7. 9.2.1.2.8.7 PMBus Address ADDR1 (Pin 9) , and ADDR0 (Pin 10)
            8. 9.2.1.2.8.8 Voltage Decoupling Capacitors
              1. 9.2.1.2.8.8.1  VDD (Pin 31)
              2. 9.2.1.2.8.8.2  BP3 (Pin 32)
              3. 9.2.1.2.8.8.3  BNEXT (Pin 24)
              4. 9.2.1.2.8.8.4  BP6 (Pin 25)
              5. 9.2.1.2.8.8.5  Power Good PGOOD1 (Pin 33), PGOOD2 (Pin 19)
              6. 9.2.1.2.8.8.6  Bootstrap Capacitors BOOT1 (Pin 30), and BOOT2 (Pin 20)
              7. 9.2.1.2.8.8.7  High-Side MOSFET (Gate) Resistor
              8. 9.2.1.2.8.8.8  Synchronization Setting SYNC (Pin 40)
              9. 9.2.1.2.8.8.9  BP6 (Pin 25)
              10. 9.2.1.2.8.8.10 DIFFO (Pin 39)
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines
      2. 11.1.2 MOSFET Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

PCB Layout Guidelines

Layout is a critical portion of good power supply design. Below are the PCB layout considerations for TPS4022 device .

  • If the analog ground (AGND) and power ground (PGND) are separated on the board, the power stage and related components should be terminated or bypassed to the power ground. Signal components of TPS4022 device should be terminated or bypassed to the analog ground. Connect the thermal pad of the TPS4022 device to power ground plane through sufficient vias. Connect AGND and PGND pins of the TPS4022 device to the thermal pad directly. The connection between AGND pin and thermal pad serves as the only connection between analog ground and power ground.
  • If one common ground is used on the board, the TPS4022 device and related components must be placed on a noise quiet area which is isolated from fast switching voltage and current paths.
  • Maintain placement of signal components and regulator bypass capacitors local to the TPS4022 device. Place them as close as possible to the pins to which they are connected. These components include the feedback resistors, frequency compensation, the RT resistor, ADDR0 and ADDR1 resistors, as well as bypass capacitors for BP3, BP6, and VDD.
  • The VSNSx and GSNSx are remotely connected to the load through low ohm resistors, and they must be routed as a differential pair on noise quiet area. Place a high-frequency bypass capacitor between the VSNSx pin and the GSNSx pin, and place the capacitor close to the TPS4022 device.
  • The CSxP pin and CSxN pin must be routed as a differential pair on noise quiet area. The resistor of R-C network should be placed close to inductor. The capacitor between CSxP pin and CSxN pin must be placed as close as possible to the TPS4022 device.
  • Place the thermal transistor close to the inductor. A bypass capacitor with a value of 1-nF or larger must be placed close to the transistor. Use a separate ground trace for the transistor.