SLUSFM0 May   2025 TPS4816-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Charge Pump and Gate Driver output (VS, GATE, BST, SRC)
      2. 8.3.2 Capacitive Load Driving
        1. 8.3.2.1 Using Bypass FET (G drive) for Load Capacitor Charging
        2. 8.3.2.2 Using Main FET's (GATE drive) Gate Slew Rate Control
      3. 8.3.3 Overcurrent and Short-Circuit Protection
        1. 8.3.3.1 I2t Based Overcurrent Protection
          1. 8.3.3.1.1 I2t based Overcurrent Protection with Auto-Retry
          2. 8.3.3.1.2 I2t based Overcurrent Protection with Latch-Off
        2. 8.3.3.2 Short-Circuit Protection
      4. 8.3.4 Analog Current Monitor Output (IMON)
      5. 8.3.5 NTC based Temperature Sensing (TMP) and Analog Monitor Output (ITMPO)
      6. 8.3.6 Fault Indication and Diagnosis (FLT)
      7. 8.3.7 Reverse Polarity Protection
      8. 8.3.8 Undervoltage (UVLO) and Overvoltage (OV) Protection
      9. 8.3.9 TPS48161-Q1 as a Simple Gate Driver
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Down
      2. 8.4.2 Shutdown Mode
      3. 8.4.3 Active Mode (AM)
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Driving Capacitve Load
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Using Main FET's (GATE drive) Gate Slew Rate Control

In the applications where low power bypass path is not used, the cap charging can be done using main FET GATE drive control.

For limiting inrush current during turn-ON of the main FET with capacitive loads, use R1, R2, C1, D2 as shown in Figure 8-4. The R1 and C1 components slow down the voltage ramp rate at the gate of main FET. The FET source follows the gate voltage resulting in a controlled voltage ramp across the output capacitors.

Use a damping resistor R2 (~ 10 Ω) in series with C1. D2 ensures fast turn OFF of GATE drive by bypassing R1.

TPS4816-Q1 Inrush Current limiting in
                    Main Path Figure 8-4 Inrush Current limiting in Main Path