SLVSHS0A March   2025  – October 2025 TPS482H85-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics_24V
    8. 6.8 Switching Characteristics_48V
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Current and Voltage Conventions
      2. 7.3.2 Accurate Current Sense
      3. 7.3.3 Adjustable Current Limit
      4. 7.3.4 Inductive-Load Switching-Off Clamp
      5. 7.3.5 Fault Detection and Reporting
        1. 7.3.5.1 Diagnostic Enable Function
        2. 7.3.5.2 Multiplexing of Current Sense
        3. 7.3.5.3 FLT Reporting
        4. 7.3.5.4 Fault Table
      6. 7.3.6 Full Diagnostics
        1. 7.3.6.1 Short-to-GND and Overload Detection
        2. 7.3.6.2 Open-Load Detection
          1. 7.3.6.2.1 Channel On
          2. 7.3.6.2.2 Channel Off
        3. 7.3.6.3 Short-to-Battery Detection
        4. 7.3.6.4 Reverse-Polarity and Battery Protection
        5. 7.3.6.5 Thermal Fault Detection
          1. 7.3.6.5.1 Thermal Protection Behavior
      7. 7.3.7 Full Protections
        1. 7.3.7.1 UVLO Protection
        2. 7.3.7.2 Loss of GND Protection
        3. 7.3.7.3 Loss of Power Supply Protection
        4. 7.3.7.4 Loss of VDD
        5. 7.3.7.5 Reverse Current Protection
        6. 7.3.7.6 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operational Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
        1. 8.4.2.1 Without a GND Network
        2. 8.4.2.2 With a GND Network
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • CHU|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Operational Modes

The device has several states to transition into based on the ENx pins and the DIAG_EN pin.

TPS482H85-Q1 State Diagram Figure 7-21 State Diagram

SLEEP

In the SLEEP state, everything inside the device is turned off and the quiscent current is the ISLEEP. The device only transitions out of the SLEEP state if the ENx pins or DIAG_EN pin is pulled high. From the SLEEP state, the device is able to transfer into the ACTIVE state if any of the ENx pins are pulled high, or into the DIAGNOSTIC state if the DIAG_EN pin, without any of the ENx pins, goes high. Additionally, if the device is in any of the states and VBB drops below VUVLOF, the device transitions into SLEEP state.

DIAGNOSTIC

The DIAGNOSTIC state is when the device is outputting diagnostics on the SNS and FLT pins. This can happen when the device is in any previous state and the DIAG_EN pin goes high. The off-state diagnostics are comprised of open load detection in off state and short to battery detection. The SNS pin only outputs a fault for the channel associated to the SEL pin values. From the DIAGNOSTIC state, the device transfers into the ACTIVE state if the DIAG_EN pin goes back low and any channel is on or the STANDBY DELAY state if all channels are OFF.

ACTIVE

The ACTIVE state is when any of the channel outputs are on by the ENx pin associated. In the ACTIVE state, the current limit value is set by the external resistor on the ILIM pin. If the DIAG_EN pin is pulled high while in the ACTIVE state, the SNS pin outputs a proportional current to the load current of the channel associated to the SEL pins configuration until a fault occurs on that channel. The device can transition out of the ACTIVE state by turning off all of the channels while DIAG_EN is high or low, or a fault occurring. If all of the channels turn off and DIAG_EN is high, the device transitions into the DIAGNOSTIC state. If all of the channels turn off and the DIAG_EN pin is low, then the device transfers into the STANDBY DELAY state. However, if the ENx pins are still high and a fault occurs, the device transitions into the FAULT state.

FAULT

The FAULT state occurs when the ENx pins are high but some event has caused the channel to behave differently from normal operation. These fault events include: absolute thermal shutdown, relative thermal shutdown, and current limit. Each of these fault events either directly or eventually shut off the channel to protect the device and system. After the device shuts off and waits for tRETRY amount of time and has cooled below the THYS threshold, the output/s that were on try to come back on again and the device transitions back into the ACTIVE state or DIAGNOSTIC state.

STANDBY DELAY

The STANDBY DELAY state is when the ENx pins are all low, outputs are all turned off and the DIAG_EN pin is also low but there has not yet been tSTBY amount of time. This state is included so that the channel outputs can be PWM'd without all of the internal rails being cut off and put to SLEEP mode. Once the device has waited tSTBY, the device completely shuts down and transitions into SLEEP. However, if during tSTBY, ENx were to go high, the device transitions into ACTIVE without shutting completely down. Similarly if the DIAG_EN goes high, the device transitions into DIAGNOSTIC.