SLVSBF1A May   2012  – February 2019 TPS53014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 Auto-Skip Eco-Mode Control
      3. 7.3.3 Drivers
      4. 7.3.4 5-Volt Regulator
      5. 7.3.5 Soft Start and Pre-Biased Soft Start
      6. 7.3.6 Overcurrent Protection
      7. 7.3.7 Over/Undervoltage Protection
      8. 7.3.8 UVLO Protection
      9. 7.3.9 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Detailed Design Procedure
        1. 8.1.1.1 Component Selection
          1. 8.1.1.1.1 Inductor
          2. 8.1.1.1.2 Output Capacitor
          3. 8.1.1.1.3 Input Capacitor
          4. 8.1.1.1.4 Bootstrap Capacitor
          5. 8.1.1.1.5 VREG5 Capacitor
          6. 8.1.1.1.6 Choose Output Voltage Resistors
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) TPS53014 UNITS
DGS (10 PINS)
θJA Junction-to-ambient thermal resistance 172.2 °C/W
θJCtop Junction-to-case (top) thermal resistance 44.0 °C/W
θJB Junction-to-board thermal resistance 93.0 °C/W
ψJT Junction-to-top characterization parameter 1.6 °C/W
ψJB Junction-to-board characterization parameter 91.4 °C/W
θJCbot Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).