SLVSJB8A July   2025  – September 2025 TPS543021

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Fixed-Frequency PWM Control
      2. 6.3.2  Light Load Operation
      3. 6.3.3  Error Amplifier
      4. 6.3.4  Slope Compensation and Output Current
      5. 6.3.5  Enable and Adjusting Undervoltage Lockout
      6. 6.3.6  Safe Start-Up into Prebiased Outputs
      7. 6.3.7  Voltage Reference
      8. 6.3.8  Adjustable Output Voltage
      9. 6.3.9  Internal Soft Start
      10. 6.3.10 Bootstrap Voltage (BOOT)
      11. 6.3.11 Overcurrent Protection
        1. 6.3.11.1 High-Side MOSFET Overcurrent Protection
        2. 6.3.11.2 Low-Side MOSFET Overcurrent Protection
      12. 6.3.12 Spread Spectrum
      13. 6.3.13 Output Overvoltage Protection (OVP)
      14. 6.3.14 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 PFM Mode Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 TPS543021 6V to 28V Input, 5V Output Converter
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Custom Design With WEBENCH® Tools
        2. 7.2.3.2 Output Voltage Setpoint
        3. 7.2.3.3 Input Capacitor Selection
        4. 7.2.3.4 Bootstrap Capacitor Selection
        5. 7.2.3.5 Undervoltage Lockout Setpoint
        6. 7.2.3.6 Output Filter Components
          1. 7.2.3.6.1 Inductor Selection
          2. 7.2.3.6.2 Output Capacitor Selection
          3. 7.2.3.6.3 Feedforward Capacitor
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.14 Thermal Shutdown

The internal thermal-shutdown circuitry forces the device to stop switching if the junction temperature exceeds 160°C typically. When the junction temperature drops below 150°C typically, the internal thermal-hiccup timer begins to count. The device re-initiates the power-up sequence after the thermal hiccup time (tOT_HICCUP) 80ms is over.