SLVS875D January   2009  – September 2023 TPS54332

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics: Characterization Curves
    8. 6.8 Typical Characteristics: Supplemental Application Curves
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Voltage Reference (Vref)
      3. 7.3.3  Bootstrap Voltage (BOOT)
      4. 7.3.4  Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
      5. 7.3.5  Programmable Slow Start Using the SS Pin
      6. 7.3.6  Error Amplifier
      7. 7.3.7  Slope Compensation
      8. 7.3.8  Current Mode Compensation Design
      9. 7.3.9  Overcurrent Protection and Frequency Shift
      10. 7.3.10 Overvoltage Transient Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 3.5 V
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Eco-mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH® Tools
        2. 8.2.2.2  Switching Frequency
        3. 8.2.2.3  Output Voltage Set Point
        4. 8.2.2.4  Input Capacitors
        5. 8.2.2.5  Output Filter Components
        6. 8.2.2.6  Inductor Selection
        7. 8.2.2.7  Capacitor Selection
        8. 8.2.2.8  Compensation Components
        9. 8.2.2.9  Bootstrap Capacitor
        10. 8.2.2.10 Catch Diode
        11. 8.2.2.11 Output Voltage Limitations
        12. 8.2.2.12 Power Dissipation Estimate
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Estimated Circuit Area
      4. 8.4.4 Electromagnetic Interference (EMI) Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 Support Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS54332UNIT
HSOP
8 PINS
RθJAJunction-to-ambient thermal resistance48.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance52.4
RθJBJunction-to-board thermal resistance25.3
ψJTJunction-to-top characterization parameter8.4
ψJBJunction-to-board characterization parameter25.2
RθJC(bot)Junction-to-case (bottom) thermal resistance2.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.