SLUSF22B November   2024  – March 2025 TPS54338 , TPS54438 , TPS54538

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Fixed Frequency Peak Current Mode
      2. 6.3.2  Mode Selection
      3. 6.3.3  Voltage Reference
      4. 6.3.4  Output Voltage Setting
      5. 6.3.5  Switching Frequency Selection / Synchronization
      6. 6.3.6  Phase Shift
      7. 6.3.7  Enable and Adjusting Undervoltage Lockout
      8. 6.3.8  External Soft Start and Prebiased Soft Start
      9. 6.3.9  Power Good
      10. 6.3.10 Minimum On Time, Minimum Off Time, and Frequency Foldback
      11. 6.3.11 Frequency Spread Spectrum
      12. 6.3.12 Overvoltage Protection
      13. 6.3.13 Overcurrent and Undervoltage Protection
      14. 6.3.14 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Modes Overview
      2. 6.4.2 Heavy Load Operation
      3. 6.4.3 Pulse Frequency Modulation
      4. 6.4.4 Forced Continuous Conduction Modulation
      5. 6.4.5 Dropout Operation
      6. 6.4.6 Minimum On-Time Operation
      7. 6.4.7 Shutdown Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Output Voltage Resistors Selection
        3. 7.2.2.3 Choosing Switching Frequency
        4. 7.2.2.4 Soft-Start Capacitor Selection
        5. 7.2.2.5 Output Inductor Selection
        6. 7.2.2.6 Output Capacitor Selection
        7. 7.2.2.7 Input Capacitor Selection
        8. 7.2.2.8 Feedforward Capacitor CFF Selection
        9. 7.2.2.9 Maximum Ambient Temperature
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS54x38 UNIT
RQF (VQFN-HR), 9 PINS
JEDEC(2) EVM(3)
RθJA Junction-to-ambient thermal resistance 89.9 N/A °C/W
RθJC(top) Junction-to-case (top) thermal resistance 79.6 N/A °C/W
RθJB Junction-to-board thermal resistance 23.1 N/A °C/W
ΨJT Junction-to-top characterization parameter 2.5 N/A °C/W
ΨJB Junction-to-board characterization parameter 23 N/A °C/W
RθJA_EVM Junction-to-ambient thermal resistance on official EVM board N/A 46.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. These values do not represent the performance obtained in an actual application.
(3) The real RθJA is tested on TI EVM.