SLVSBW6B April   2013  – December 2016 TPS54627

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start and Prebiased Soft Start
      2. 7.3.2 Output Discharge Control
      3. 7.3.3 Current Protection
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 UVLO Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 PWM Frequency and Adaptive On-Time Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Resistors Selection
        2. 8.2.2.2 Output Filter Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Bootstrap Capacitor Selection
        5. 8.2.2.5 VREG5 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN, EN –0.3 20 V
VBST –0.3 26
VBST (10-ns transient) –0.3 28
VBST (vs SW) –0.3 6.5
VFB, SS –0.3 6.5
SW –2 20
SW (10-ns transient) –3 22
Output voltage VREG5 –0.3 6.5 V
GND –0.3 0.3
Voltage from GND to thermal pad, VDIFF –0.2 0.2 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range, (unless otherwise noted)
MIN MAX UNIT
VIN Supply input voltage 4.5 18 V
Input voltage VBST –0.1 24 V
VBST (10-ns transient) –0.1 27
VBST (vs SW) –0.1 6
SS –0.1 5.7
EN –0.1 18
VFB –0.1 5.5
SW –1.8 18
SW (10-ns transient) –3 21
GND –0.1 0.1
VO Output voltage VREG5 –0.1 5.7 V
IO Output current IVREG5 0 5 mA
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature –40 150 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS54627 UNIT
DDA (SO PowerPAD)
8 PINS
RθJA Junction-to-ambient thermal resistance 43.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 49.4 °C/W
RθJB Junction-to-board thermal resistance 25.6 °C/W
ψJT Junction-to-top characterization parameter 7.4 °C/W
ψJB Junction-to-board characterization parameter 25.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Over operating free-air temperature range, VIN = 12 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IVIN Operating non-switching supply current VIN current, TA = 25°C, EN = 5 V,
VFB = 0.8 V		 950 1400 µA
IVINSDN Shutdown supply current VIN current, TA = 25°C, EN = 0 V 3 10 µA
LOGIC THRESHOLD
VEN EN high-level input voltage EN 1.6 V
EN low-level input voltage EN 0.6 V
REN EN pin resistance to GND VEN = 12 V 200 400 800 kΩ
VFB VOLTAGE AND DISCHARGE RESISTANCE
VFBTH VFB threshold voltage TA = 25°C, VO = 1.05 V, continuous mode operation 757 765 773 mV
TA = –40 to 85°C, VO = 1.05 V, continuous mode operation(1) 751 765 779 mV
IVFB VFB input current VFB = 0.8 V, TA = 25°C 0 ±0.15 µA
VREG5 OUTPUT
VVREG5 VREG5 output voltage TA = 25°C, 6 V < VIN < 18 V,
0 < IVREG5 < 5 mA		 5.2 5.5 5.7 V
IVREG5 Output current VIN = 6 V, VREG5 = 4 V, TA = 25°C 20 mA
VOUT DISCHARGE
RDISCHG VOUT discharge resistance EN = 0 V, SW = 0.5 V, TA = 25°C 500 800 Ω
MOSFET
RDS(on) High-side switch resistance TA = 25°C, VBST – SW = 5.5 V 36 mΩ
Low-side switch resistance TA = 25°C 28 mΩ
CURRENT LIMIT
IOCL Current limit L out = 1.5 µH(1) 6.7 7.3 8.9 A
THERMAL SHUTDOWN
TSDN Thermal shutdown threshold Shutdown temperature (1) 165 °C
Hysteresis (1) 35
ON-TIME TIMER CONTROL
tON ON time VIN = 12 V, VO = 1.05 V 150 ns
tOFF(MIN) Minimum OFF time TA = 25°C, VFB = 0.7 V 260 310 ns
SOFT START
ISS SS charge current VSS = 1 V 4.2 6 7.8 µA
SS discharge current VSS = 0.5 V 1.5 3.3 mA
HICCUP AND OVERVOLTAGE PROTECTION
VOVP Output OVP threshold OVP Detect (L > H) 125%
VHICCUP Output Hiccup threshold Hiccup detect (H > L) 65%
THICCUPDELAY Output Hiccup delay To hiccup state 250 µs
THICCUPENDELAY Output Hiccup Enable delay Relative to soft-start time ×1.7
UVLO
UVLO UVLO threshold Wake-up VREG5 voltage 3.45 3.75 4.05 V
Hysteresis VREG5 voltage 0.13 0.32 0.48
(1) Not production tested.

6.6 Typical Characteristics

VIN = 12 V, TA = 25°C (unless otherwise noted).
TPS54627 C001_SLVSBW6.png Figure 1. Supply Current vs Junction Temperature
TPS54627 C003_SLVSBW6.png Figure 3. EN Input Current vs EN Input Voltage
TPS54627 C004_SLVSBW6.png Figure 5. 1.05-V Output Voltage vs Output Current
TPS54627 C008_SLVSBW6.png Figure 7. Efficiency vs Output Current
TPS54627 C010_SLVSBW6.png Figure 9. Switching Frequency vs Output Current
TPS54627 C002_SLVSBW6.png Figure 2. Shutdown Current
vs Junction Temperature
TPS54627 C011_SLVSBW6.png Figure 4. VFB Voltage vs Junction Temperature
TPS54627 C005_SLVSBW6.png Figure 6. 1.05-V Output Voltage vs Input Voltage
TPS54627 C009_SLVSBW6.png Figure 8. Switching Frequency vs Input Voltage
TPS54627 C012_SLVSBW6.png Figure 10. Output Current vs Ambient Temperature