SLIS132A October   2008  – March 2015 TPS55065-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Dissipation Ratings
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Switched-Mode Input/Output Terminals (L1, L2)
      2. 7.3.2  Supply Terminal (Vdriver)
      3. 7.3.3  Internal Supply Decoupling Terminal (Vlogic)
      4. 7.3.4  Input Voltage Monitoring Terminal (AIN)
      5. 7.3.5  Input Undervoltage Alarm Terminal (AOUT)
      6. 7.3.6  Reset Delay Timer Terminal (REST)
      7. 7.3.7  Reset Terminal (RESET)
      8. 7.3.8  Main Regulator Output Terminal (VOUT)
      9. 7.3.9  Low-Power-Mode Terminal (CLP)
      10. 7.3.10 Switch-Output Terminal (5Vg)
      11. 7.3.11 5Vg-Enable Terminal (5Vg_ENABLE)
      12. 7.3.12 Slew-Rate Control Terminals (SCR0, SCR1)
      13. 7.3.13 Modulator Frequency Setting (Terminal Rmod)
      14. 7.3.14 Ground Terminal (PGND)
      15. 7.3.15 Enable Terminal (ENABLE)
      16. 7.3.16 Bootstrap Terminals (CBOOT1 and CBOOT2)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Clock Modulator
      2. 7.4.2 Buck/Boost Transitioning
      3. 7.4.3 Buck SMPS
      4. 7.4.4 Boost SMPS
      5. 7.4.5 Extension of the Input Voltage Range on V(driver)
      6. 7.4.6 Low-Power Mode
      7. 7.4.7 Temperature and Short-Circuit Protection
      8. 7.4.8 Switch Output Terminal (5Vg) Current Limitation
      9. 7.4.9 Soft Start
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Buck Mode
        2. 8.2.2.2 Boost Mode
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Inductor
      2. 10.1.2 Filter Capacitors
      3. 10.1.3 Traces and Ground Plane
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

  • PowerPAD Thermally Enhanced Package, SLMA002

11.2 Trademarks

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.