SLVSBV3B April   2013  – November 2016 TPS56528

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation
      2. 7.3.2 PWM Frequency and Adaptive On-Time Control
      3. 7.3.3 Soft Start and Prebiased Soft Start
      4. 7.3.4 Power Good
      5. 7.3.5 Output Discharge Control
      6. 7.3.6 Current Protection
      7. 7.3.7 UVLO Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Advanced Auto-Skip Eco-Mode™ Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Resistors Selection
        2. 8.2.2.2 Output Filter Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Bootstrap Capacitor Selection
        5. 8.2.2.5 VREG5 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Information
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN and EN –0.3 20 V
VBST –0.3 26
VBST (10-ns-transient) –0.3 28
VBST (vs SW) –0.3 6.5
VFB and PG –0.3 6.5
SW –2 20
SW (10-ns-transient) –3 22
Output voltage VREG5 –0.3 6.5 V
GND –0.3 0.3
Voltage from GND to thermal pad, Vdiff –0.2 0.2 V
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Supply input voltage 4.5 18 V
VI Input voltage VBST –0.1 24 V
VBST (10-ns-transient) –0.1 27
VBST(vs SW) –0.1 6
PG –0.1 5.7
EN –0.1 18
VFB –0.1 5.5
SW –1.8 18
SW (10-ns-transient) –3 21
GND –0.1 0.1
VO Output voltage (VREG5) –0.1 5.7 V
IO Output current (IVREG5) 0 5 mA
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature –40 150 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS56528 UNIT
DDA (SO PowerPAD)
8 PINS
RθJA Junction-to-ambient thermal resistance 44.4 °C/W
RθJCtop Junction-to-case (top) thermal resistance 51.6 °C/W
RθJB Junction-to-board thermal resistance 27.8 °C/W
ψJT Junction-to-top characterization parameter 8.7 °C/W
ψJB Junction-to-board characterization parameter 27.7 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance 5.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range, VIN = 12 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
I(VIN) Operating non-switching supply current VIN current, TA = 25°C, EN = 5 V,
V(FB) = 0.7 V		 170 350 μA
I(VINSDN) Shutdown supply current VIN current, TA = 25°C, EN = 0 V 3.8 10 µA
LOGIC THRESHOLD
V(EN) EN high-level input voltage EN 1.6 V
EN low-level input voltage EN 0.6 V
R(EN) EN pin resistance to GND VEN = 12 V 180 350 700 kΩ
VFB VOLTAGE AND DISCHARGE RESISTANCE
V(FBTH) V(FB) threshold voltage TA = 25°C, VO = 1.05 V, IO = 10 mA, advanced Eco-Mode operation 606 mV
TA = 25°C, VO = 1.05 V, continuous mode operation 593 600 607 mV
TA = -40 to 85°C, VO = 1.05 V, continuous mode operation(1) 588 600 612 mV
I(VFB) V(FB) input current V(FB) = 0.7 V, TA = 25°C 0 ±0.15 µA
SW DISCHARGE
I(DISCHG) SW discharge current EN = 0 V, SW = 1 V, TA = 25°C 1 1.5 mA
V(REG5) OUTPUT
V(VREG5) VREG5 output voltage TA = 25°C, 6.0 V < VIN < 18 V,
0 < I(VREG5) < 5 mA		 5.2 5.5 5.7 V
I(VREG5) Output current VIN = 6 V, V(REG5) = 4 V, TA = 25°C 20 mA
MOSFET
RDS(on) High-side switch resistance 25°C, V(BST) - SW = 5.5 V 68 mΩ
Low-side switch resistance 25°C 37 mΩ
CURRENT LIMIT
I(ocl) Current limit LOUT = 1.5 µH(1) 5.5 6.2 7.8 A
THERMAL SHUTDOWN
T(SDN) Thermal shutdown threshold Shutdown temperature (1) 165 °C
Hysteresis (1) 35
POWER GOOD
V(THPG) PG threshold VFB rising (good) 85% 90% 95%
VFB falling (Fault) 85%
IPG PG sink current PG = 0.5 V 2 4 mA
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
VOVP Output OVP threshold OVP Detect (L>H) 125%
VUVP Output UVP threshold UVP detect (H>L) 65%
UVLO
UVLO UVLO threshold Wake-up VREG5 voltage 3.45 3.75 4.05 V
Hysteresis VREG5 voltage 0.13 0.32 0.48
(1) Not production tested.

6.6 Timing Requirements

MIN NOM MAX UNIT
ON-TIME TIMER CONTROL
tON On-time VIN = 12 V, VO = 1.05 V 150 ns
tOFF(MIN) Minimum off-time TA = 25°C, VFB = 0.5 V 260 310 ns
SOFT START
tSS Soft-start time Internal soft-start time 0.7 1 1.3 ms
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
tUVPDEL Output UVP delay to hiccup state 7 µs
tUVPEN Output UVP enable delay Relative to soft-start time ×1.7

6.7 Typical Characteristics

VIN = 12 V and TA = 25°C (unless otherwise noted)
TPS56528 C004_SLVSBV3.png
Figure 1. VIN Supply Current vs Junction Temperature
TPS56528 C014_SLVSBV3.png
Figure 3. EN Current vs EN Voltage
TPS56528 C007_SLVSBV3.png
Figure 5. 1.05-V Output Voltage vs Input Voltage
TPS56528 C012_SLVSBV3.png
Figure 7. Switching Frequency vs Output Current
TPS56528 C019_SLVSBV3.gif
Figure 9. Output Current vs Ambient Temperature
TPS56528 C001_SLVSBV3.png
Figure 2. VIN Shutdown Current vs Junction Temperature
TPS56528 C010_SLVSBV3.png
Figure 4. 1.05-V Output Voltage vs Output Current
TPS56528 C011_SLVSBV3.png
Figure 6. Switching Frequency vs Input Voltage
TPS56528 C015_SLVSBV3.png
Figure 8. VFB Voltage vs Junction Temperature