SLUS525A March   2007  – September 2015 TPS61050 , TPS61052

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Efficiency
      2. 7.3.2 Soft-Start
      3. 7.3.3 Shutdown
      4. 7.3.4 LED Failure Modes
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes: Torch and Flash
      2. 7.4.2 Mode of Operation: Flash Blanking (TPS61050)
      3. 7.4.3 Hardware Voltage Mode Selection (TPS61052)
      4. 7.4.4 Low Light Dimming Mode
    5. 7.5 Programming
      1. 7.5.1 3-Bit ADC
      2. 7.5.2 Serial Interface Description
      3. 7.5.3 F/S-Mode Protocol
      4. 7.5.4 TPS6105X I2C Update Sequence
    6. 7.6 Register Maps
      1. 7.6.1 Register Description
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application Schematic
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selecton
          2. 8.2.1.2.2 Capacitor Selection
            1. 8.2.1.2.2.1 Input Capacitor
            2. 8.2.1.2.2.2 Output Capacitor
          3. 8.2.1.2.3 Checking Loop Stability
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High-Power White LED Solution Featuring Privacy Indicator
      3. 8.2.3 High-Power White LED Solution Featuring No-Latency Turn-Down Through PA TX Signal
      4. 8.2.4 High-Power White LED Flash Driver And AF/Zoom Motor Drive Supply
      5. 8.2.5 White LED Flash Driver and Audio Amplifier Power Supply Exclusive Operation
      6. 8.2.6 White LED Flash Driver and Audio Amplifier Power Supply Operating Simultaneously
      7. 8.2.7 White LED Flash Driver and Auxiliary Lighting Zone Power Supply
      8. 8.2.8 2 × 300 mA Dual LED Camera Flash
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Summary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks.

The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.

To lay out the control ground, TI recommends using short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.

10.2 Layout Example

TPS61050 TPS61052 pcblay_lus525.gif Figure 62. Typical PC-Board Layout

10.3 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Use the following three basic approaches for enhancing thermal performance:

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow in the system

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. The maximum junction temperature (TJ) of the TPS6105x is 150°C.

The maximum power dissipation gets especially critical when the device operates in the linear down mode at high LED current. For single pulse power thermal analysis (for example, flash strobe), the allowable power dissipation for the device is given by Figure 63.

TPS61050 TPS61052 pwr_disp_lus525.gif Figure 63. Single Pulse Power Capability (CSP Package)