SLVS625E February   2006  – November 2015 TPS61150 , TPS61151

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Tables
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-Up
      2. 8.3.2 Overvoltage Protection (OVP)
      3. 8.3.3 Undervoltage Lockout
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Enable
    4. 8.4 Device Functional Modes
      1. 8.4.1 Current Regulation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Maximum Output Current
        2. 9.2.2.2 WLED Brightness Dimming
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Input and Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Additional Application Circuits
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (July 2009) to E Revision

  • Changed "QFN" package to "VSON" throughout documentGo
  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted obsolete Dissipation Ratings table Go

Changes from C Revision (November 2008) to D Revision

  • Deleted Lead temperature specification from Absolute Maximum Ratings tableGo
  • Corrected FET error in Figure 9Go